DEVICE AND METHOD FOR CUTTING OFF SUBSTRATE OF FRAGILE MATERIAL

WIPO Patent Application WO/2006/129563

A1

A method and a device for cutting off a substrate of fragile material which can prevent the substrate of fragile material from being damaged or contaminated through contact by preventing contact of divided surfaces in a break process for cutting off the substrate of fragile material continuously. The device for cutting off a substrate of fragile material comprises dividing means (112, 122) for exerting a pressing force to the vicinity of a scribe line S formed on a substrate G and cutting off the substrate G at the pressed portion, and a holding portion moving substantially in parallel with the scribe line S while holding the dividing means to cut off the substrate G continuously along the scribe line S. The holding portion is provided with divided surface separating means (113, 123) for pressing at least one part of the divided substrate G while clamping it, and moving the substrate G substantially in parallel with the major surface thereof and in such a direction that the opposing divided surfaces obtained by cutting off separate from each other.

NISHISAKA YUKI (JP)
OTODA KENJI (JP)
INOUE SHUICHI (JP)
KUMAGAI TORU (JP)

PCT/JP2006/310541

December 07, 2006

May 26, 2006

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MITSUBOSHI DIAMOND IND CO LTD (JP)
NISHISAKA YUKI (JP)
OTODA KENJI (JP)
INOUE SHUICHI (JP)
KUMAGAI TORU (JP)

B28D5/00; B31B50/25; C03B33/033

WO2004096721A1

2004-11-11

JPS5355319A	1978-05-19
JPS4937101B1	1974-10-05
JPS5015807A	1975-02-19
JPS4931289B1	1974-08-20
JP2002018797A	2002-01-22
JP2000191333A	2000-07-11

Yamamoto, Shusaku (Crystal Tower 2-27, Shiromi 1-chome, Chuo-k, Osaka-shi Osaka 15, JP)

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