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Patent Searching and Data


Title:
DEVICE AND METHOD FOR DETECTING BENDING AND WARPING OF SILICON WAFER OF SOLAR CELL
Document Type and Number:
WIPO Patent Application WO/2018/188654
Kind Code:
A1
Abstract:
The present invention provides a device and method for detecting the bending and the warping of a silicon wafer of a solar cell. A feeding mechanism places the silicon wafer of the solar cell on a conveying mechanism. The conveying mechanism drives the silicon wafer of the solar cell to move to a detection box. When a photoelectric sensor detects that there is a silicon wafer of the solar cell reaching the position above a lower carrier plate, a lifting cylinder drives the lower carrier plate to move up and cover the opening of the detection box, so that the detection box has no light inside. Then, a scanning lamp is started to emit light onto the silicon wafer of the solar cell, and the light passes through an optical system and enters a CCD camera for imaging. An image is sent to an image processing system. The image processing system processes the image, and compares the image with a standard image. The comparison result is sent to a computer host and displayed by a display. Accordingly, the bending and warping are detected.

Inventors:
SUN TIETUN (CN)
YAO WEIZHONG (CN)
TANG PING (CN)
Application Number:
PCT/CN2018/083021
Publication Date:
October 18, 2018
Filing Date:
April 13, 2018
Export Citation:
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Assignee:
EGING PHOTOVOLTAIC TECH CO LTD (CN)
International Classes:
H01L21/66
Foreign References:
CN106876298A2017-06-20
CN206628448U2017-11-10
CN201844980U2011-05-25
CN205385011U2016-07-13
JPS63266848A1988-11-02
Other References:
See also references of EP 3614421A4
Attorney, Agent or Firm:
CHANGZHOU INNOVATION PATENT AGENCY FIRM (GENERAL PARTNER) (CN)
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