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Patent Searching and Data


Title:
DEVICE AND METHOD FOR FORMING FILM BY MEANS OF PHYSICAL SPUTTERING
Document Type and Number:
WIPO Patent Application WO/2018/196071
Kind Code:
A1
Abstract:
Disclosed is a device for forming a film by means of physical sputtering, said device comprising a vacuum cavity (1); a substrate table (2) arranged in the vacuum cavity (1), wherein a substrate (21) with a film to be formed is arranged on the substrate table; a target material (3) arranged in the vacuum cavity (1) and opposite the substrate (21); at least one sheet resistance meter (4) connected to the target material (3) for measuring the actual resistance value of the target material in real time; an excitation source used for bombarding the target material (3) to make same sputter target material atoms; and a control system (6) connected to the sheet resistance meter (4). The device for forming a film by means of physical sputtering has a simple structure, can monitor the consumption of the target material (3) in real time, effectively prevents damage to a back plate (31) and product abnormality caused by the breakdown of the target material (3), thereby increasing the product yield, and also improves the usage efficiency of the target material (3), and avoids the wasting of material caused by the incomplete use of the target material (3).

Inventors:
LIU SIYANG (CN)
Application Number:
PCT/CN2017/085839
Publication Date:
November 01, 2018
Filing Date:
May 25, 2017
Export Citation:
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Assignee:
WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO LTD (CN)
International Classes:
C23C14/34
Foreign References:
CN102443770A2012-05-09
CN103173735A2013-06-26
CN204125528U2015-01-28
CN104746025A2015-07-01
KR20040005378A2004-01-16
CN102492931A2012-06-13
Attorney, Agent or Firm:
YUHONG INTELLECTUAL PROPERTY LAW FIRM (CN)
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