Title:
DEVICE AND METHOD FOR HIGH-PRESSURE WATER JETTING SURFACE CUTTING
Document Type and Number:
WIPO Patent Application WO/2005/007337
Kind Code:
A1
Abstract:
A high-pressure water jetting surface cutting device has a high-pressure water jetting nozzle head that is movable in the X-Y directions while rotating and cuts a resin matrix portion on the surface of a composite formed product made of inorganic grains and a resin. High-pressure jetting nozzles (3A, 3B) are arranged on the nozzle head, and at least one or more of high-pressure water jetting centers are arranged at an angle (Ѳ) inclined to a vertical plane relative to a base layer surface of the composite formed product. The resin matrix surface layer with an uneven surface shape or a slope portion with a relief pattern can be effectively cut and removed.
Inventors:
SAKAI MIEKO (JP)
SAITO KENICHIRO (JP)
SAITO KENICHIRO (JP)
Application Number:
PCT/JP2004/010447
Publication Date:
January 27, 2005
Filing Date:
July 15, 2004
Export Citation:
Assignee:
AVAILVS CORP (JP)
SAKAI MIEKO (JP)
SAITO KENICHIRO (JP)
SAKAI MIEKO (JP)
SAITO KENICHIRO (JP)
International Classes:
B26F3/00; (IPC1-7): B23P17/00; C04B41/72
Foreign References:
| JPH09100181A | 1997-04-15 | |||
| JPH07137012A | 1995-05-30 | |||
| JP2003175496A | 2003-06-24 |
Other References:
See also references of EP 1649971A4
Attorney, Agent or Firm:
Nishizawa, Toshio (11-1 Minami-Aoyama 6-chom, Minato-ku Tokyo, JP)
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