DEVICE AND METHOD FOR ON-LINE MEASUREMENT OF WAFER THINNING AND GRINDING FORCE

WIPO Patent Application WO/2020/077670

A1

A device for the on-line measurement of a wafer thinning and grinding force, comprising a semiconductor wafer (1), a bonding adhesive (2), a thin film pressure sensor (3), a worktable (4), a bearing table (5), a wafer spindle bottom base (6), a data processing and wireless transmission module, and a wireless receiving module. The semiconductor wafer is connected to a worktable surface of the worktable by means of the bonding adhesive. A method for the on-line measurement of a wafer thinning and grinding force uses the device for the on-line measurement of the wafer thinning and grinding force to monitor in real time a grinding force during a semiconductor wafer grinding process. The thin film pressure sensor has a short response time and high test accuracy, and may monitor the grinding force in real time during a process of rotating the wafer and the spindle to thereby avoid the rotation and winding risks of the wafer.

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QIN FEI (CN)
ZHANG LIXIANG (CN)
ZHAO SHUAI (CN)
CHEN PEI (CN)
AN TONG (CN)
DAI YANWEI (CN)

PCT/CN2018/112610

April 23, 2020

October 30, 2018

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UNIV BEIJING TECHNOLOGY (CN)

B24B49/00

CN102441840A	2012-05-09
CN105598805A	2016-05-25
CN206393384U	2017-08-11
CN1981992A	2007-06-20
KR20150002483A	2015-01-07

BEIJING SIHAI TIANDA INTELLECTUAL PROPERTY AGENCY LTD. (CN)

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