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Patent Searching and Data


Title:
DEVICE AND METHOD FOR MAKING HOLE IN THIN PLATE METAL
Document Type and Number:
WIPO Patent Application WO/2010/084527
Kind Code:
A1
Abstract:
A device (1) for making a hole in thin plate metal has an upper die holder (2) vertically moved by a hydraulic ram, a pressing plate (3) secured to the upper die holder (2), a pressing pad (5) suspended from the upper die holder (2) via an elastic member (4), a punch holder (7) secured to the pressing pad (5) by bolts (6) and constructed as a punch unit, a lower die (9) on which thin plate metal (8) in which a hole is to be made is placed, and a die (11) embedded in the lower die (9) and provided with a through-hole (10) having an oval shape corresponding to the shape of the through-hole to be made in the thin plate metal (8).

Inventors:
OISHI MASATOSHI (JP)
ARAMIZU TERUO (JP)
Application Number:
PCT/JP2009/000244
Publication Date:
July 29, 2010
Filing Date:
January 22, 2009
Export Citation:
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Assignee:
ONES CO LTD (JP)
OILES INDUSTRY CO LTD (JP)
OISHI MASATOSHI (JP)
ARAMIZU TERUO (JP)
International Classes:
B21D28/34; B21D28/24
Foreign References:
JPH06122028A1994-05-06
JP2008290088A2008-12-04
JP2002321023A2002-11-05
Attorney, Agent or Firm:
TAKADA, TAKESHI (JP)
Takeshi Takada (JP)
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