Title:
DEVICE AND METHOD FOR MANUFACTURING EMBLEM WITH INCORPORATED IC CHIP
Document Type and Number:
WIPO Patent Application WO/2015/166584
Kind Code:
A1
Abstract:
A device for manufacturing an emblem with an incorporated IC chip is obtained from an upper mold (11) having at least a fusion-cutting blade, a table (31), a support frame (41) disposed on the perimeter and upper surface of the table (31), a sliding plate (51) disposed on the upper surface of the table and slidable with respect to the table (31) in the axial direction, and a metal plate (61) disposed on the upper surface of the sliding plate (51). The upper surface of the metal plate (61) is provided with a flat surface (63) and a recess (65) formed in dimensions that abut against an IC chip (6). High frequency induction heating of an upper layer material (2a) is performed at the flat surface (63) to form an intermediate (23). Welding the intermediate (23) with a lower layer material by high frequency induction heating with the IC chip (6) disposed at a position above the recess (65) prevents damage of the IC chip (6) due to high frequency induction heating by pressure from the metal carving mold from above the IC chip (6).
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Inventors:
KUWAHARA EIJI (JP)
Application Number:
PCT/JP2014/062181
Publication Date:
November 05, 2015
Filing Date:
May 02, 2014
Export Citation:
Assignee:
KURODA NOBUO (JP)
KUWAHARA EIJI (JP)
KUWAHARA EIJI (JP)
International Classes:
B44C5/00
Domestic Patent References:
| WO2011125173A1 | 2011-10-13 |
Foreign References:
| JP2010277186A | 2010-12-09 | |||
| JP2010214867A | 2010-09-30 | |||
| JP2001504402A | 2001-04-03 | |||
| US20040136175A1 | 2004-07-15 |
Other References:
See also references of EP 3138695A4
Attorney, Agent or Firm:
ICHIKAWA MAKOTO (JP)
Makoto Ichikawa (JP)
Makoto Ichikawa (JP)
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