Title:
DEVICE AND METHOD FOR MANUFACTURING MOLDED OBJECTS
Document Type and Number:
WIPO Patent Application WO/2011/122202
Kind Code:
A1
Abstract:
The disclosed device for manufacturing molded objects is provided with: a device body to which a cavity-containing mold is mounted; a first channel member that supplies a powder to the cavities; a top compression member that has a top punch surface which compresses the powder in the cavities; a bottom compression member that has a bottom punch surface which, along with the top punch surface, compresses the powder; and a second channel member via which molded objects released from the mold are ejected. At least 80% of the total surface area of the following is nonmetallic: the top surface of the device body, the surfaces of the walls that separate the cavities, the inner surface of the first flow member, the inner surface of the second flow member, the top punch surface, and the bottom punch surface.
Inventors:
UEDA Shigehisa (5-8 Higashi-shinagawa 2-chome, Shinagawa-k, Tokyo 02, 〒1400002, JP)
上田 茂久 (〒02 東京都品川区東品川２丁目５番８号 住友ベークライト株式会社内 Tokyo, 〒1400002, JP)
上田 茂久 (〒02 東京都品川区東品川２丁目５番８号 住友ベークライト株式会社内 Tokyo, 〒1400002, JP)
Application Number:
JP2011/054587
Publication Date:
October 06, 2011
Filing Date:
March 01, 2011
Export Citation:
Assignee:
SUMITOMO BAKELITE COMPANY LIMITED (5-8 Higashi-shinagawa 2-chome, Shinagawa-ku Tokyo, 02, 〒1400002, JP)
住友ベークライト株式会社 (〒02 東京都品川区東品川２丁目５番８号 Tokyo, 〒1400002, JP)
UEDA Shigehisa (5-8 Higashi-shinagawa 2-chome, Shinagawa-k, Tokyo 02, 〒1400002, JP)
住友ベークライト株式会社 (〒02 東京都品川区東品川２丁目５番８号 Tokyo, 〒1400002, JP)
UEDA Shigehisa (5-8 Higashi-shinagawa 2-chome, Shinagawa-k, Tokyo 02, 〒1400002, JP)
International Classes:
B30B11/08; B30B11/00; B30B11/02; H01L23/29; H01L23/31
Attorney, Agent or Firm:
ASAHI Kazuo et al. (Nishi-Shinbashi Noa Bldg. 4th Floor, 18-9 Nishi-Shinbashi 1-chome, Minato-k, Tokyo 03, 〒1050003, JP)
Claims: