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Patent Searching and Data


Title:
DEVICE AND METHOD FOR MANUFACTURING MULTILAYER MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2018/034218
Kind Code:
A1
Abstract:
A die 31 having a cavity 32, and a lower punch 41 fitted into the cavity 32 are divided and slid along a division plane 34 passing through the cavity 32 parallel to the fitting direction of the die 31 and the lower punch 41, whereby divided cavities 32A, 32B are placed in a state of alignment along the division plane 34, the divided cavities 32A, 32B are each filled with a raw material powder, and the die 31 and the lower punch 41 are then slid along the division plane 34, whereby the divided cavities 32A, 32B are combined as the original cavity 32, and the raw material powder in the cavity 32 in the combined state is compressed by an upper punch and the lower punch 41.

Inventors:
MARUYAMA, Tsuneo (3-1-1 Kogane-cho, Higashi-ku, Niigata-sh, Niigata 40, 〒9508640, JP)
TAKEZOE, Shinichi (3-1-1 Kogane-cho, Higashi-ku, Niigata-sh, Niigata 40, 〒9508640, JP)
SAKAI, Hideo (3-1-1 Kogane-cho, Higashi-ku, Niigata-sh, Niigata 40, 〒9508640, JP)
Application Number:
JP2017/029027
Publication Date:
February 22, 2018
Filing Date:
August 10, 2017
Export Citation:
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Assignee:
DIAMET CORPORATION (3-1-1, Kogane-cho Higashi-ku, Niigata-sh, Niigata 40, 〒9508640, JP)
International Classes:
B22F7/06; B22F3/035; B30B11/00; B30B11/02
Attorney, Agent or Firm:
AOYAMA, Masakazu (Seiyo Patent Office, 3F Shin-Chiyoda Kyodo Bldg. 3-3-9, Kandakajicho, Chiyoda-k, Tokyo 45, 〒1010045, JP)
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