Title:
DEVICE AND METHOD FOR MEASURING SHAPE
Document Type and Number:
WIPO Patent Application WO/2011/152037
Kind Code:
A1
Abstract:
In the disclosed device and method, compound lenses (202, 203, 204) are disposed—on the light axis of light that is incident to a measured object (105) and light towards a reference mirror (107)—of which the achromatic conditions, beam diameter conditions, and color difference reduction conditions of each are optimized using the focal distance and/or the Abbe number of a collimator lens; and by means of correcting the wavefront using these compound lenses (202, 203, 204), the effect of wavefront aberration is abated, and the resolution of shape measurement by means of optical interference is increased.
Inventors:
HAMANO, Seiji (())
濱野 誠司 (())
KUSAKA, Yusuke (())
濱野 誠司 (())
KUSAKA, Yusuke (())
Application Number:
JP2011/003044
Publication Date:
December 08, 2011
Filing Date:
May 31, 2011
Export Citation:
Assignee:
PANASONIC CORPORATION (1006, Oaza Kadoma Kadoma-sh, Osaka 01, 〒5718501, JP)
パナソニック株式会社 (〒01 大阪府門真市大字門真１００６番地 Osaka, 〒5718501, JP)
HAMANO, Seiji (())
濱野 誠司 (())
パナソニック株式会社 (〒01 大阪府門真市大字門真１００６番地 Osaka, 〒5718501, JP)
HAMANO, Seiji (())
濱野 誠司 (())
International Classes:
G01B11/24; G01B9/02
Attorney, Agent or Firm:
TANAKA, Mitsuo et al. (AOYAMA & PARTNERS, IMP Building 3-7, Shiromi 1-chome, Chuo-ku, Osaka-sh, Osaka 01, 〒5400001, JP)
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Claims:
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