Title:
DEVICE AND METHOD FOR MEASURING THICKNESS OF WORKPIECE AND WORKPIECE POLISHING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2024/048120
Kind Code:
A1
Abstract:
A device for measuring the thickness of a workpiece according to the present invention comprises: a housing; a measurement unit that is disposed in the housing and that measures the thickness of the workpiece; and a flow straightener that is disposed in the housing and that straightens an air flow in the housing. The measurement unit is provided with a spectral interference sensor. A workpiece polishing system according to the present invention is configured such that the device for measuring the thickness of the workpiece is installed in each of a workpiece carry-in part and a workpiece carry-out part. A method for measuring the thickness of a workpiece according to the present invention involves measuring the thickness of the workpiece by using a measurement unit provided with a spectral interference sensor. The measurement unit is disposed in a housing. The thickness of the workpiece is measured by the measurement unit while straightening an air flow in the housing by using a flow straightener disposed in the housing.
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Inventors:
MIYAZAKI YUJI (JP)
TAKANASHI KEIICHI (JP)
TAKANASHI KEIICHI (JP)
Application Number:
PCT/JP2023/026872
Publication Date:
March 07, 2024
Filing Date:
July 21, 2023
Export Citation:
Assignee:
SUMCO CORP (JP)
International Classes:
G01B9/02055; G01B11/06
Foreign References:
| JP2021004796A | 2021-01-14 | |||
| JP2009032756A | 2009-02-12 | |||
| JP2001284426A | 2001-10-12 | |||
| JP2003220556A | 2003-08-05 | |||
| JP2013068489A | 2013-04-18 | |||
| JP2022535218A | 2022-08-05 | |||
| JP2002324750A | 2002-11-08 | |||
| JPH10300125A | 1998-11-13 |
Attorney, Agent or Firm:
SUGIMURA Kenji (JP)
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