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Patent Searching and Data


Title:
DEVICE AND METHOD FOR MOLDING MOLDED RESIN ARTICLE
Document Type and Number:
WIPO Patent Application WO/2016/117682
Kind Code:
A1
Abstract:
[Problem] To provide a device and a method for molding a molded resin article that make it possible to ensure good molding properties and achieve a reduction in thickness without imposing constraints on the type of resin that is used. [Solution] A method for molding a molded resin article, said method being characterized by comprising: a step in which a thermoplastic resin is extruded as a molten sheet at a predetermined extrusion speed so as to hang downward; a step in which the molten sheet of resin that has been extruded downward is sandwiched by a pair of rollers and fed downward by the rotational driving power of the rollers so that it is possible to perform first stretching of the molten sheet of resin; a step in which the molten sheet of resin that is fed downward is pulled downward so that it is possible to perform second stretching thereof; a step in which the pulled molten sheet of resin is arranged on the side of a mold arranged below the pair of rollers; and a step in which the molten sheet of resin is molded into a shape corresponding to the shape of the mold by reducing the pressure in a sealed space formed between the molten sheet of resin and the mold and/or by pressing the sheet of resin toward the metal mold.

Inventors:
YAMASAKI YOSHIHIRO (JP)
HARASAWA YUKI (JP)
Application Number:
PCT/JP2016/051849
Publication Date:
July 28, 2016
Filing Date:
January 22, 2016
Export Citation:
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Assignee:
KYORAKU CO LTD (JP)
International Classes:
B29C51/04; B29C49/04; B29C51/10; B29C48/07; B29C48/385; B29C48/475
Foreign References:
JP2011051224A2011-03-17
JPH115248A1999-01-12
JPH0760845A1995-03-07
JPH0542584A1993-02-23
Other References:
See also references of EP 3248754A4
Attorney, Agent or Firm:
OKA KIYOSHI (JP)
岡 潔 (JP)
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