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Patent Searching and Data


Title:
DEVICE AND METHOD FOR MONITORING MANUFACTURING STATUS OF SEAMLESS PIPE AND SEAMLESS PIPE MANUFACTURING FACILITY
Document Type and Number:
WIPO Patent Application WO/2008/032508
Kind Code:
A1
Abstract:
A device for monitoring the manufacturing status of a seamless pipe, capable of quickly correcting manufacturing conditions during operation of a seamless pipe manufacturing facility. The device (20) for monitoring the manufacturing status of a seamless pipe has an ultrasonic wall thickness meter (4) installed on the outlet side of a piercing mill (10), which manufactures a pipe (S) by subjecting a billet (B) to a rolling and piercing process, and measuring the wall thickness of the pipe (S) manufactured by the piercing mill (10), a temperature meter (5) installed on the outlet side of the piercing mill (10) and measuring the temperature of the surface of the pipe (S) manufactured by the piercing mill (10), and calculation and display means (6) for displaying the wall thickness distribution in the circumferential direction of the pipe (S) and the surface temperature distribution in the circumferential direction of the pipe (S), with the display based on the wall thickness of the pipe (S) measured by the ultrasonic wall thickness gauge (4) and on the surface temperature of the pipe (S) measured with the temperature meter (5).

Inventors:
IWAMOTO HIROYUKI (JP)
Application Number:
PCT/JP2007/065350
Publication Date:
March 20, 2008
Filing Date:
August 06, 2007
Export Citation:
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Assignee:
SUMITOMO METAL IND (JP)
IWAMOTO HIROYUKI (JP)
International Classes:
B21B19/04; B21B23/00; B21C51/00
Foreign References:
JPS597407A1984-01-14
JP2001121203A2001-05-08
JP2005134321A2005-05-26
JP2001141437A2001-05-25
JPS61135409A1986-06-23
JPH0871616A1996-03-19
Other References:
TETSU-TO-HAGANE, 1970, pages 1139 - 1145
See also references of EP 2080569A4
Attorney, Agent or Firm:
OHNAKA, Minoru (3-6 Minamisemba 2-chome, Chuo-ku, Osaka-sh, Osaka 81, JP)
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