Title:
DEVICE AND METHOD FOR MONITORING MANUFACTURING STATUS OF SEAMLESS PIPE AND SEAMLESS PIPE MANUFACTURING FACILITY
Document Type and Number:
WIPO Patent Application WO/2008/032508
Kind Code:
A1
Abstract:
A device for monitoring the manufacturing status of a seamless pipe, capable of
quickly correcting manufacturing conditions during operation of a seamless pipe
manufacturing facility. The device (20) for monitoring the manufacturing status
of a seamless pipe has an ultrasonic wall thickness meter (4) installed on the
outlet side of a piercing mill (10), which manufactures a pipe (S) by subjecting a
billet (B) to a rolling and piercing process, and measuring the wall thickness of
the pipe (S) manufactured by the piercing mill (10), a temperature meter (5) installed
on the outlet side of the piercing mill (10) and measuring the temperature of the
surface of the pipe (S) manufactured by the piercing mill (10), and calculation and
display means (6) for displaying the wall thickness distribution in the circumferential direction
of the pipe (S) and the surface temperature distribution in the circumferential direction
of the pipe (S), with the display based on the wall thickness of the pipe (S) measured
by the ultrasonic wall thickness gauge (4) and on the surface temperature of the
pipe (S) measured with the temperature meter (5).
Inventors:
IWAMOTO, Hiroyuki (5-33, Kitahama 4-chome, Chuo-ku, Osaka-sh, Osaka 41, 5410041, JP)
Application Number:
JP2007/065350
Publication Date:
March 20, 2008
Filing Date:
August 06, 2007
Export Citation:
Assignee:
Sumitomo Metal Industries, Ltd. (5-33, Kitahama 4-chome Chuo-ku, Osaka-sh, Osaka 41, 5410041, JP)
住友金属工業株式会社 (〒41 大阪府大阪市中央区北浜４丁目５番３３号 Osaka, 5410041, JP)
住友金属工業株式会社 (〒41 大阪府大阪市中央区北浜４丁目５番３３号 Osaka, 5410041, JP)
International Classes:
B21B19/04; B21B23/00; B21C51/00; B21B19/00; B21B23/00; B21C51/00
Attorney, Agent or Firm:
OHNAKA, Minoru (Osaka-Hokushin bldg. 4F, 3-6 Minamisemba 2-chome, Chuo-ku, Osaka-sh, Osaka 81, 5420081, JP)
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