Title:
DEVICE AND METHOD FOR PROCESSING SUBSTRATE, AND METHOD FOR PRODUCING A PROCESSED SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2011/007476
Kind Code:
A1
Abstract:
Disclosed are a device for processing a substrate and a method for processing a substrate employing said processing device, which are simple and make it possible to provide a processed substrate which has a smooth surface. Also provided is a method for producing a processed substrate employing said processing method. A device (10) for processing a substrate (1) has disposed thereon a member (12) for spraying abrasive grains (12a) in such a way that the angle of spraying of the abrasive grains (12a) with respect to the surface of the substrate (1) which is being processed is an angle employed in brittleness processing, and a spray direction changing member (18) for changing the angle of entry of the abrasive grains (12a) onto the processing surface of the substrate (1) from an angle employed in brittleness processing to an angle employed in ductility processing is disposed between the spraying member (12) and the processing surface of the substrate (1) in the direction of spraying of the abrasive grains (12a). The spray direction changing member (18) is moveable.
Inventors:
YOSHIZAWA, Takenori (())
吉澤武徳 (())
吉澤武徳 (())
Application Number:
JP2010/002197
Publication Date:
January 20, 2011
Filing Date:
March 26, 2010
Export Citation:
Assignee:
SHARP KABUSHIKI KAISHA (22-22, Nagaike-cho Abeno-ku, Osaka-sh, Osaka 22, 〒5458522, JP)
シャープ株式会社 (〒22 大阪府大阪市阿倍野区長池町２２番２２号 Osaka, 〒5458522, JP)
YOSHIZAWA, Takenori (())
シャープ株式会社 (〒22 大阪府大阪市阿倍野区長池町２２番２２号 Osaka, 〒5458522, JP)
YOSHIZAWA, Takenori (())
International Classes:
B24C1/04; B24C5/02; B24C5/04
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (Daiwa Minamimorimachi Building, 2-6 Tenjinbashi 2-chome Kita, Kita-ku, Osaka-sh, Osaka 41, 〒5300041, JP)
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