Title:
DEVICE AND METHOD FOR SUPPLYING SURFACE-MOUNT COMPONENT, AND SURFACE-MOUNT COMPONENT STRIP USED FOR SAME
Document Type and Number:
WIPO Patent Application WO/2023/132689
Kind Code:
A1
Abstract:
The present invention relates to a device and a method capable of directly supplying a surface-mount component to a surface mounting device without using a carrier tape, and a surface-mount component strip used therefor. A device for supplying a surface-mount component according to the present invention comprises: a feed roller for transferring a surface-mount component strip in a unit of a single surface-mount component; a support block for supporting the surface-mount component strip transferred by the feed roller; and a fixing means for fixing, to a cutting die, the surface-mount component supported by the support block; a bell crank having a blade which cuts and separates the surface-mount component fixed to the cutting die from the surface-mount component strip; and an actuator for operating the bell crank.
More Like This:
| JPS58178000 | 【考案の名称】チツプ状部品の位置決め機構 |
| JPH09307300 | METHOD FOR CORRECTING PARTS LOADING POSITION |
| JP2002217594 | METHOD AND APPARATUS FOR INSERTING ELECTRONIC COMPONENT |
Inventors:
LEE SEUNG HEE (KR)
Application Number:
PCT/KR2023/000293
Publication Date:
July 13, 2023
Filing Date:
January 06, 2023
Export Citation:
Assignee:
LEE SEUNG HEE (KR)
International Classes:
H05K13/04; B65H20/22
Foreign References:
| JPH09312495A | 1997-12-02 | |||
| KR101969673B1 | 2019-08-14 | |||
| KR0124843Y1 | 1998-12-15 | |||
| JPH0769311A | 1995-03-14 | |||
| JPH0572788U | 1993-10-05 |
Attorney, Agent or Firm:
KANGIN PATENT LAW FIRM (KR)
Download PDF: