Title:
DEVICE AND METHOD FOR TREATING WAFER-SHAPED ARTICLES
Document Type and Number:
WIPO Patent Application WO/2013/080106
Kind Code:
A3
Abstract:
A method and device for processing wafer-shaped articles comprises a closed process chamber. A rotary chuck is located within the process chamber, and is adapted to hold a wafer shaped article thereon. An interior fluid distribution ring is positioned above the rotary chuck, and comprises an annular surface inclined downwardly from a radially inner edge to a radially outer edge thereof. At least one fluid distribution nozzle extends into the closed process chamber and is positioned so as to discharge fluid onto the annular surface of the fluid distribution ring.
Inventors:
TSCHINDERLE ULRICH (AT)
BRUGGER MICHAEL (AT)
GLEISSNER ANDREAS (AT)
BRUGGER MICHAEL (AT)
GLEISSNER ANDREAS (AT)
Application Number:
PCT/IB2012/056667
Publication Date:
August 01, 2013
Filing Date:
November 23, 2012
Export Citation:
Assignee:
LAM RES AG (AT)
LAM RES CORP (US)
TSCHINDERLE ULRICH (AT)
BRUGGER MICHAEL (AT)
GLEISSNER ANDREAS (AT)
LAM RES CORP (US)
TSCHINDERLE ULRICH (AT)
BRUGGER MICHAEL (AT)
GLEISSNER ANDREAS (AT)
International Classes:
H01L21/67
Foreign References:
| US20070277734A1 | 2007-12-06 | |||
| US20070012339A1 | 2007-01-18 | |||
| US20100206481A1 | 2010-08-19 | |||
| US20060151014A1 | 2006-07-13 |
Attorney, Agent or Firm:
KONTRUS, Gerhard (SEZ-Strasse 1, Villach, AT)
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