Title:
DEVICE MODULE AND MANUFACTURING METHOD THEREFOR, AND ARRAY OF INDUCTORS AND CAPACITORS
Document Type and Number:
WIPO Patent Application WO/2022/214072
Kind Code:
A1
Abstract:
The present invention relates to a device module and a manufacturing method therefor, and an array of inductors and capacitors. The device module comprises a first conductive layer, a second conductive layer, and a first functional layer and a second functional layer arranged between the first conductive layer and the second conductive layer, wherein a plurality of capacitors and a plurality of through hole electrodes isolated from the plurality of capacitors are provided in the first functional layers; and a plurality of inductors are formed in the second functional layer, each of the inductors being arranged in the thickness direction of the second functional layer such that a first terminal of the inductor is electrically connected to the first conductive layer via a corresponding through hole electrode, and a second terminal of the inductor is electrically connected to the second conductive layer. In the device module of the present invention, by means of the solution of directly mounting a driver on a multi-inductor array that is longitudinally arranged at a pin, the layout and connection lines of a multi-phase circuit are significantly simplified, and the effective utilization of inductor and capacitor materials is promoted.
Inventors:
TAN LEI (CN)
Application Number:
PCT/CN2022/085786
Publication Date:
October 13, 2022
Filing Date:
April 08, 2022
Export Citation:
Assignee:
SG MICRO CORP (CN)
International Classes:
H03H11/28
Foreign References:
| CN109088612A | 2018-12-25 | |||
| JP2001076952A | 2001-03-23 | |||
| CN111200351A | 2020-05-26 | |||
| JP2006311203A | 2006-11-09 | |||
| JP2019176025A | 2019-10-10 |
Attorney, Agent or Firm:
TOWIN INTELLECTUAL PROPERTY AGENCY LTD. (CN)
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