Title:
DEVICE MODULE
Document Type and Number:
WIPO Patent Application WO/2022/196544
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a technology capable of cooling a device even when the device is not stored in a duct. A device module according to the present invention includes a support member disposed in a roof interior space between a roof panel and an interior member of a vehicle, and a device supported by a support surface in an outer surface of the support member. The support member has a support-member-side passage formed inside thereof, and the support-member-side passage is connected to a duct-side passage in a duct of the vehicle.
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Inventors:
SATO TATSUMI (JP)
SONE KOSUKE (JP)
YAMAMOTO YASUYUKI (JP)
TANIGUCHI TAKUYA (JP)
TAKEHISA AI (JP)
SONE KOSUKE (JP)
YAMAMOTO YASUYUKI (JP)
TANIGUCHI TAKUYA (JP)
TAKEHISA AI (JP)
Application Number:
PCT/JP2022/010769
Publication Date:
September 22, 2022
Filing Date:
March 11, 2022
Export Citation:
Assignee:
AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
B60H1/00; B60R11/02; B60H1/34; B60R16/02
Foreign References:
| JP2005239133A | 2005-09-08 | |||
| JP2014033017A | 2014-02-20 | |||
| US20050231907A1 | 2005-10-20 | |||
| US20210076534A1 | 2021-03-11 | |||
| JP2003034120A | 2003-02-04 |
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (JP)
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