Title:
DEVICE FOR PRODUCING CIRCUIT BOARD AND METHOD FOR PRODUCING CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2014/087578
Kind Code:
A1
Abstract:
This device for producing a circuit board has a sheet supply unit, one set of main laminate rolls, a heat retention mechanism, and one set of takeoff rolls. The sheet supply unit supplies plastic sheets to the front and back of a pre-preg. The main laminate rolls are capable of heating the pre-preg to the softening point or above, and rotate to transport the plastic sheets and the pre-preg threaded therebetween. The heat retention mechanism is arranged to the discharge end of the main laminate rolls, and maintains the pre-preg, to which the plastic sheets have been laminated by the main laminate rolls, at the softening point or above. The takeoff rolls are arranged to the discharge end of the heat retention mechanism, and rotate to transport the pre-preg threaded therebetween, which having been discharged from the heat retention mechanism has cooled to below the softening point.
Inventors:
ISHIMARU YUKIHIRO
KISHIMOTO KUNIO
TAKENAKA TOSHIAKI
KISHIMOTO KUNIO
TAKENAKA TOSHIAKI
Application Number:
PCT/JP2013/006588
Publication Date:
June 12, 2014
Filing Date:
November 08, 2013
Export Citation:
Assignee:
PANASONIC CORP (JP)
International Classes:
H05K3/40; B29C65/02; B32B15/08
Foreign References:
| JP2803579B2 | 1998-09-24 | |||
| JPH04345843A | 1992-12-01 | |||
| JP2006160899A | 2006-06-22 | |||
| JP2006310872A | 2006-11-09 | |||
| JP2009090581A | 2009-04-30 |
Attorney, Agent or Firm:
NAITO, Hiroki et al. (JP)
Hiroki Naito (JP)
Hiroki Naito (JP)
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