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Patent Searching and Data


Title:
DEVICE FOR REPAIRING CRACK IN WALL
Document Type and Number:
WIPO Patent Application WO/2017/073148
Kind Code:
A1
Abstract:
The present invention provides a device for repairing a crack in a wall, wherein even when the contact balance of an injection nozzle and a contact member with respect to a wall surface is disrupted to a certain extent, an arm is unlikely to tilt to the right or left, while the injection nozzle is prevented from being uplifted or separated from the crack, thereby ensuring reliable injection of a filler into the crack. The device is provided with: an injection nozzle 1 that has a leading end placed at a crack K in a wall W and injects a filler into the crack K; a suction pad 10 that is fixed on a support shaft 22 in which an inhalation passage 21 is formed for inhaling air and that is capable of adhering to a wall surface Wa when air is inhaled through the inhalation passage 21, and being separated from the wall surface Wa when the inhalation is ceased; an arm 30 that has a front end portion and a rear end portion in the axial direction, that is supported midway along the axial direction by the support shaft 22 via a first universal joint JA, and that supports, at the front end portion, an inflow pipe 3 of the injection nozzle 3 via a second universal joint JB; and a plurality of contact members 50 that are mounted on the rear end portion of the arm 30 such that the leading ends thereof come into contact with the wall surface Wa and that receive a moment load generated in the arm 30 when the filler is being injected through the injection nozzle 1. The plurality of contact members 50 are provided in a direction orthogonal to the direction of the axis P of the arm 30.

Inventors:
SASAKI TAKAHIKO (JP)
SASAKI YOSHIHIRO (JP)
Application Number:
PCT/JP2016/074522
Publication Date:
May 04, 2017
Filing Date:
August 23, 2016
Export Citation:
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Assignee:
SAKAEGUMI CORP (JP)
International Classes:
E04G23/02; B05C5/02
Foreign References:
JP4351712B22009-10-28
JP2007200738A2007-08-09
JP2001295868A2001-10-26
JP3142597U2008-06-19
JPS61244912A1986-10-31
JPH0473612U1992-06-29
JPS60197383A1985-10-05
JP2003129675A2003-05-08
JP2008157336A2008-07-10
JPH04118467A1992-04-20
JPH0449376A1992-02-18
Attorney, Agent or Firm:
HEIWA INTERNATIONAL PATENT OFFICE (JP)
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