Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
DEVICE TEMPERATURE ADJUSTING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2018/047533
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a device temperature adjusting apparatus which is capable of improving summer cooling performance with respect to a device to be subjected to temperature adjustment. This device temperature adjusting apparatus adjusts the temperature of a device (12) to be subjected to temperature adjustment, and is provided with a refrigerant circuit (38) and a working fluid circuit (26). A refrigerant circulates in the refrigerant circuit. The refrigerant circuit is provided with a compressor (40), a condenser (42), a decompression device (44), and an evaporator (46), and forms a refrigeration cycle. Furthermore, a working fluid circulates in the working fluid circuit. The working fluid circuit is provided with: a heat absorber (14) which causes the working fluid to absorb heat from the device to be subjected to temperature adjustment; and a radiator (16) which causes heat to be released from the working fluid. The evaporator is provided in an air-conditioning unit (30), and evaporates the refrigerant to cool air flowing through the air-conditioning unit. Furthermore, the radiator is formed so as to be capable of exchanging heat with the evaporator.

Inventors:
TAKEUCHI MASAYUKI (JP)
KATO YOSHIKI (JP)
YAMANAKA TAKASHI (JP)
OMI YASUMITSU (JP)
YOSHINORI TAKESHI (JP)
MIURA KOJI (JP)
Application Number:
PCT/JP2017/028057
Publication Date:
March 15, 2018
Filing Date:
August 02, 2017
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
DENSO CORP (JP)
International Classes:
B60H1/00; B60K11/04; B60L11/18; F25B1/00
Domestic Patent References:
WO2016133145A12016-08-25
Foreign References:
JP2008049796A2008-03-06
JPS52108745U1977-08-18
JPS61223204A1986-10-03
JP2014074537A2014-04-24
JP2009292224A2009-12-17
JP2012255624A2012-12-27
Attorney, Agent or Firm:
YOU-I PATENT FIRM (JP)
Download PDF: