Title:
DEVICE TEMPERATURE ADJUSTING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2018/047539
Kind Code:
A1
Abstract:
A device temperature adjusting apparatus (1) is provided with: a device heat exchanger (12) which functions as an evaporator during cooling of a device (BP) to be subjected to temperature adjustment, and functions as a radiator during warming of the device to be subjected to temperature adjustment; and a condenser (14) which condenses a gaseous working fluid. The device temperature adjusting apparatus is further provided with: a gas passage (16) which guides, to the condenser, the working fluid evaporated into a gas by the device heat exchanger; and a liquid passage (18) which guides, to the device heat exchanger, the working fluid condensed into a liquid by the condenser. The device temperature adjusting apparatus is also provided with: a heating unit (20) which heats the working fluid present in a device fluid circuit (10); and a liquid amount adjustment unit (30) which adjusts the amount of the liquid working fluid present inside the device heat exchanger. The device heat exchanger includes a heat exchange region (121) which exchanges heat with the device to be subjected to temperature adjustment. The liquid amount adjustment unit adjusts the amount of the liquid working fluid present inside the device heat exchanger such that the occupancy ratio of the gaseous working fluid inside the heat exchange region is higher during warming of the device to be subjected to temperature adjustment, than during cooling thereof.
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Inventors:
MIURA KOJI (JP)
OMI YASUMITSU (JP)
TAKEUCHI MASAYUKI (JP)
YOSHINORI TAKESHI (JP)
YAMANAKA TAKASHI (JP)
KATO YOSHIKI (JP)
OMI YASUMITSU (JP)
TAKEUCHI MASAYUKI (JP)
YOSHINORI TAKESHI (JP)
YAMANAKA TAKASHI (JP)
KATO YOSHIKI (JP)
Application Number:
PCT/JP2017/028063
Publication Date:
March 15, 2018
Filing Date:
August 02, 2017
Export Citation:
Assignee:
DENSO CORP (JP)
International Classes:
F28D15/06; B60K11/02; F28D15/02; H01M10/613; H01M10/615; H01M10/625; H01M10/633; H01M10/643; H01M10/647; H01M10/6556; H01M10/6569; H01M10/6571; H01M10/663; H01M10/667
Foreign References:
| JP2015041418A | 2015-03-02 | |||
| US20120003516A1 | 2012-01-05 | |||
| JPH0460384A | 1992-02-26 | |||
| JPS62182593A | 1987-08-10 |
Attorney, Agent or Firm:
YOU-I PATENT FIRM (JP)
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