DEVICE TEMPERATURE ADJUSTMENT APPARATUS

WIPO Patent Application WO/2019/054076

A1

In the present invention a device temperature adjustment unit (10) has one or more device heat exchangers (11-14) configured so as to be capable of exchanging heat between a subject device and a working fluid such that the working fluid evaporates during cooling of the subject device. A condenser (50) causes the gas-phase working fluid to dissipate heat, and thereby discharges condensed liquid-phase working fluid. A liquid-phase passage (55) allows the liquid-phase working fluid to flow between the condenser (50) and the device temperature adjustment unit (10). A plurality of gas-phase passages (21-24, 30-32, and 40-42) allow the gas-phase working fluid to flow between the device temperature adjustment unit (10) and the condenser (50). A first connection part (211), which is for connecting the device temperature adjustment unit (10) to a first gas-phase passage (21) among the plurality of gas-phase passages, and a second connection part (221), which is for connecting device temperature adjustment unit (10) to a second gas-phase passage (22) among the plurality of gas-phase passages, are positioned at locations separated from each other in a horizontal direction.

MIURA KOJI (JP)
OMI YASUMITSU (JP)
YOSHINORI TAKESHI (JP)
TAKEUCHI MASAYUKI (JP)

PCT/JP2018/029095

March 21, 2019

August 02, 2018

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DENSO CORP (JP)

F28D15/02; F25D9/00; F28D15/06; H01L23/427; H01M10/6552; H05K7/20

WO2016031195A1

2016-03-03

JP2000065456A	2000-03-03
JP2013083413A	2013-05-09
JP2016017732A	2016-02-01
JP2005019904A	2005-01-20
JP2017116151A	2017-06-29
JP2007533944A	2007-11-22
US20090014155A1	2009-01-15

YOU-I PATENT FIRM (JP)

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