DEVICE UTILIZING HEAT PUMP - MITSUBISHI ELECTRIC CORP

Title:

DEVICE UTILIZING HEAT PUMP

Document Type and Number:

WIPO Patent Application WO/2019/003268

Kind Code:

A1

Abstract:

A device utilizing a heat pump comprises a refrigerant circuit and a heat transfer medium circuit. The refrigerant circuit can execute a first operation in which a load-side heat exchanger functions as a condenser and a second operation in which the load-side heat exchanger functions as an evaporator. A container is provided in intake piping between a refrigerant channel switching device and a compressor. A pressure protection device and a refrigerant leak detection device are connected to the heat transfer medium circuit. When a refrigerant leak into the heat transfer medium circuit is detected, the refrigerant channel switching device is put in the second operation state, an expansion device is put in a closed state, and the compressor runs; and when compressor operation end conditions are satisfied after the refrigerant leak into the heat transfer medium circuit is detected, the compressor stops, and the refrigerant channel switching device is put in the first operation state.

Inventors:

SUZUKI YASUHIRO (JP)
MINAMISAKO HIROKAZU (JP)
SUZUKI KAZUTAKA (JP)
MITO TAKAFUMI (JP)
HATTORI TARO (JP)

Application Number:

PCT/JP2017/023379

Publication Date:

January 03, 2019

Filing Date:

June 26, 2017

Export Citation:

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Assignee:

MITSUBISHI ELECTRIC CORP (JP)

International Classes:

F25B49/02; F25B13/00

Domestic Patent References:

WO2013038577A1	2013-03-21
WO2010050007A1	2010-05-06

Foreign References:

JP2013167395A	2013-08-29
JP6081033B1	2017-02-15
JP2014224612A	2014-12-04
JP2001208392A	2001-08-03
JP2000104940A	2000-04-11
JP2013167398A	2013-08-29

Other References: