Title:
DEVICE WITH BUILT-IN INTEGRATED CIRCUIT
Document Type and Number:
WIPO Patent Application WO/2012/090590
Kind Code:
A1
Abstract:
Provided is a device with a built-in integrated circuit, capable of suppressing leakage outside the device of electromagnetic waves that have an adverse impact outside the device, while continuing to suppress increase in device weight. The device (display device) with the built-in integrated circuit comprises: a first wiring substrate (3) having a first control device (M1) (microcomputer) mounted thereon; and a second wiring substrate (11) facing the first wiring substrate (3) and having a second control device (M2) (graphic controller) mounted thereon. The first control device (M1) and the second control device (M2), which emit electromagnetic waves to outside the device, are positioned between the first wiring substrate (3) and the second wiring substrate (11). The first wiring substrate (3) has a first electromagnetic shield (S1) and the second wiring substrate (11) has a second electromagnetic shield (S2). The first electromagnetic shield (S1) and the second electromagnetic shield (S2) overlap, when viewed from the normal direction of the opposing surfaces of the substrates, and the first control device (M1) and the second control device (M2) are positioned in the overlapping section.
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Inventors:
TAKANO,Tetsuhiro (())
高野 徹弘 (())
高野 徹弘 (())
Application Number:
JP2011/075771
Publication Date:
July 05, 2012
Filing Date:
November 09, 2011
Export Citation:
Assignee:
NIPPON SEIKI CO.,LTD. (2-34, Higashi-zaoh 2-chomeNagaoka-sh, Niigata 80, 〒9408580, JP)
日本精機株式会社 (〒80 新潟県長岡市東蔵王２丁目２番３４号 Niigata, 〒9408580, JP)
TAKANO,Tetsuhiro (())
日本精機株式会社 (〒80 新潟県長岡市東蔵王２丁目２番３４号 Niigata, 〒9408580, JP)
TAKANO,Tetsuhiro (())
International Classes:
H05K9/00; B60K35/00; H05K1/02; H05K1/14
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Claims: