Title:
LAYERING/MOLDING DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/044163
Kind Code:
A1
Abstract:
A layering/molding device (100) comprises: a machining optical system that has an objective lens through which a machining light passes, and that irradiates the machining light onto a machining position; a measurement illumination unit (8) that supplies an illumination light for measuring the dimensions of a fabricated object (4) which is formed; a light-receiving element that detects a reflected light which is the illumination light that has been reflected off the fabricated object (4); a light-receiving optical system that condenses the reflected light onto the light-receiving element; a calculation unit (50) that calculates, by means of a calculation using a detection result of the reflected light by the light-receiving element, the width of the fabricated object (4) in a third direction which is perpendicular to a first direction in which the machining position is moved with respect to a machining object (3), and to a second direction in which a bead is layered; and a control unit (51) that controls, on the basis of the calculation result of the width of the fabricated object (4), a machining condition for forming the bead. The objective lens which constitutes the machining optical system also serves as an objective lens which constitutes the light-receiving optical system, or as an objective lens that projects the illumination light from the measurement illumination unit (8) onto the fabricated object (4).
Inventors:
TAKUSHIMA SHIGERU (JP)
MORITA DAIJI (JP)
MORITA DAIJI (JP)
Application Number:
PCT/JP2020/032170
Publication Date:
March 03, 2022
Filing Date:
August 26, 2020
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
B23K26/34; B23K26/342
Foreign References:
| JP6576593B1 | 2019-09-18 | |||
| JP2009083326A | 2009-04-23 | |||
| JP2017160471A | 2017-09-14 | |||
| JP2019137071A | 2019-08-22 | |||
| JP2015199086A | 2015-11-12 |
Attorney, Agent or Firm:
TAKAMURA, Jun (JP)
Download PDF: