Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
DEVICES AND METHODS FOR LAYER-BY-LAYER ASSEMBLY
Document Type and Number:
WIPO Patent Application WO/2014/066862
Kind Code:
A3
Abstract:
Devices and associated methods are provided herein for creating arrays of thin films on a substrate utilizing a capillary force layer-by-layer assembly. Such devices and methods can be configured for forming one or more channels when the device is in operable contact with the substrate, each channel having an inlet reservoir at one end by which the coating material is introduced into the channel, wherein each channel is a lengthwise enclosure defined by a surface of the substrate on one side and one or more adjacent structures of the assembly surrounding the channel along its length. Provided devices and methods facilitate automated, precise manufacture of arrays of customized thin films for lab-on-a-chip biological and/or chemical assay products, for example. Additionally, provided devices and methods significantly reduce material waste, improves quality control, and expands the potential applications of LBL into new research space.

Inventors:
LI WEI (US)
CASTLEBERRY STEVEN ANDREW (US)
HAMMOND PAULA T (US)
Application Number:
PCT/US2013/066980
Publication Date:
June 05, 2014
Filing Date:
October 25, 2013
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MASSACHUSETTS INST TECHNOLOGY (US)
International Classes:
B01J19/00; B01L3/02; B01L3/00; C12M1/32
Domestic Patent References:
WO1995011748A11995-05-04
Foreign References:
US6089853A2000-07-18
DE29907804U11999-10-07
Attorney, Agent or Firm:
CAHILL, John J. et al. (HALL & STEWART LLPTwo International Plac, Boston Massachusetts, US)
Download PDF: