POWER TRANSMISSION

TECHNICAL FIELD

[0001] This application relates generally to wireless power transmission systems, including but not limited to, reducing mutual coupling effects in a wireless power

transmission system.

BACKGROUND

[0002] Electronic devices, such as laptop computers, smartphones, portable gaming devices, tablets, and others, require power to operate. Electronic devices are often charged at least once a day, with high-use or power-hungry electronic devices requiring charging several times per day. Such activity may be tedious and present a burden to users. For example, a user may be required to carry chargers for each electronic device. In addition, users may have to find available power sources to connect to, which is inconvenient and time consuming. Lastly, some users must plug into a wall or some other power supply to be able to charge their electronic devices. Such activity may render electronic devices immobile and/or inoperable while charging.

[0003] Some conventional charging solutions include wireless charging stations, such as an inductive charging surface employing magnetic induction or resonating coils. Antennas may be combined or brought within close proximity on an array. However, coupling and interference increases as antennas are brought within close proximity to each other, thereby reducing the effectiveness of these conventional charging solutions.

[0004] Therefore, there is a need in the art to address the above-described drawbacks of far-field antennas and near-field antennas and create structures that reduce coupling and interfering effects among antennas.

SUMMARY

[0005] Accordingly, there is a need for systems and/or devices with more efficient, effective, and accurate methods for wireless charging. Such systems, devices, and methods optionally complement or replace conventional systems, devices, and methods for wireless charging. Systems, devices, and methods disclosed herein address the aforementioned issues and provide a number other benefits as well. For example, antennas for wireless power transmission described herein include (I) devices and methods of reducing mutual coupling effects in wireless power transmission systems, (II) microstrip antennas for wireless power transmitters, and (III) surface mount dielectric antennas for wireless power transmitters.

(I) Summary of devices and methods of reducing mutual coupling effects in wireless power transmission systems

[0006] In one aspect (I), The disclosed embodiments include different structures which hold several antennas and create a gap between the antennas. In some embodiments, the gap is made up of a periodic wire medium. In some embodiments, the periodic wire medium reduces the mutual coupling between different antennas. The antennas are attached in an array in some embodiments. In some embodiments, several antennas are attached to a respective structure in a random pattern. In some embodiments, the periodic wire medium composes a plurality of isolating components.

[0007] In some embodiments, an apparatus includes a transmitter with a plurality of antennas. In some embodiments, the apparatus further includes a metallic base configured for receiving a plurality of antennas, the metallic base having a periodic wire medium along a perimeter of the metallic base and between each of the plurality of antennas, and the periodic wire medium extending upwardly from the metallic base, whereby a mutual coupling between each of the plurality of antennas is reduced by the periodic wire medium. In some embodiments, the transmitter transmits power wirelessly to a receiver.

[0008] In some embodiments, the antenna is attached to a printed circuit board (PCB) via a transmission line, which supplies a first current source, and the metallic structure provides a second current source to the periodic wire medium, where the second current source is different from the first current source. In some embodiments, the wire medium and/or the metallic structure supporting the wire medium is connected to a ground.

[0009] In some embodiments, the apparatus uses at least two of the antennas for wireless power transmission, and transmits such that the electromagnetic radiation from the two antennas creates constructive interference at a location of the receiver that receives the wireless power.

[0010] In some embodiments, a transmitter comprising a plurality of antennas is configured to wirelessly transmit power to a receiver. In some embodiments, a metallic base is configured to accommodate the plurality of antennas, the metallic base having a periodic wire medium along a perimeter of the metallic base and between each of the plurality of antennas, the periodic wire medium extending upwardly from the metallic base, whereby a mutual coupling between each of the plurality of antennas is reduced by the periodic wire medium.

[0011] In some embodiments, the periodic wire medium is formed using a plurality of isolating components. For example, in accordance with some embodiments, a transmitter device for a wireless charging system includes: (1) at least two antennas configured to direct electromagnetic waves toward a wireless power receiver such that the electromagnetic waves interfere constructively at a location proximate to the wireless power receiver; (2) a housing structure configured to receive the at least two antennas. In some embodiments, the housing structure includes: (a) a metallic base; (b) a first set of isolating components extending upwardly relative to the metallic base and defining a first region of the housing structure that is configured to receive a first antenna of the at least two antennas; and (c) a second set of isolating components extending upwardly relative to the metallic base and defining a second region of the housing structure that is configured to receive a second antenna of the at least two antennas, the second set including at least some isolating components distinct from those in the first set. In some embodiments, the first and second sets of isolating components are configured (i) to create a physical gap in the housing structure between the first and second antennas and (ii) to reduce a mutual coupling between the first antenna and the second antenna.

[0012] Thus, systems and devices are provided with more efficient and accurate methods for wirelessly transmitting power, thereby increasing the effectiveness, efficiency, and user satisfaction with such systems and devices. Such methods may complement or replace conventional methods for wirelessly transmitting power.

(II) Summary of microstrip antennas for wireless power transmitters

[0013] In another aspect (II), an antenna for use in a wireless power transmission system includes a first multi-layer printed circuit board (PCB) that includes a top surface and a bottom surface that is opposite the top surface, and the top and bottom surfaces of the first multi-layer PCB include a first electrically conductive material. The antenna additionally comprises a second multi-layer PCB that includes a top surface and a bottom surface that is opposite the top surface, and the top and bottom surfaces of the second multi-layer PCB include a second electrically conductive material. A first plurality of vias each substantially pass through the top and bottom surfaces of the first multi-layer PCB. A second plurality of vias each substantially pass through the top and bottom surfaces of the second multi-layer PCB. The antenna further includes a dielectric slab that is configured to receive the first multi -layer PCB and the second multi -layer PCB.

[0014] In some embodiments, a method for forming an antenna includes forming a dielectric assembly by coupling a dielectric slab to a first multi-layer PCB and a second multi -layer PCB. The first multi -layer PCB includes a top surface and a bottom surface that is opposite the top surface. The top and bottom surfaces of the first multi-layer PCB include a first electrically conductive material. A first plurality of vias each substantially pass through the top and bottom surfaces of the first multi-layer PCB. The second multi-layer PCB includes a top surface and a bottom surface that is opposite the top surface. The top and bottom surfaces of the second multi-layer PCB include a second electrically conductive material. A second plurality of vias each substantially pass through the top and bottom surfaces of the second multi-layer PCB. The method also includes coupling at least one feed to the dielectric assembly. fill) Summary of surface mount dielectric antennas for wireless power transmitters

[0015] In yet another aspect (Al), a wireless power transmission antenna includes a printed circuit board (PCB) including a first transmission line that conducts a first power transmission signal. The wireless power transmission antenna also includes a dielectric resonator that is mechanically coupled to the PCB and configured to radiate the first power transmission signal. The wireless power transmission antenna also includes a first feed element that is electronically coupled to the first transmission line and to the dielectric resonator. The first feed element is configured to receive the first power transmission signal via the first transmission line and excite the dielectric resonator with the first power transmission signal.

[0016] (A2) In some embodiments of (Al), the first feed element is a dipole element.

[0017] (A3) In some embodiments of (A2), the mechanical coupling of the dielectric resonator to the PCB includes a mounting platform that is coupled to the dielectric resonator and to the PCB; and the mounting platform isolates at least a portion of the dipole element from the PCB.

[0018] (A4) In some embodiments of (A2), at least a portion of the dipole element includes a meandering line feature that increases the effective length of the dipole element.

[0019] (A5) In some embodiments of any of (A1)-(A4), the PCB includes a plurality of vias that pass through the PCB. [0020] (A6) In some embodiments of (A5), the plurality of vias at least partially surround the dielectric resonator.

[0021] (A7) In some embodiments of (Al), the PCB includes a plurality of patches.

Each respective patch of the plurality of patches is electronically coupled to a respective via of a plurality of vias, the respective via passing through the PCB to couple the respective patch with a ground plane that is coupled to the first transmission line of the PCB. In some embodiments, the first feed element is the plurality of patches.

[0022] (A8) In some embodiments of (A7), each patch of the plurality of patches is fabricated from a metamaterial.

[0023] (A9) In some embodiments of any of (A7)-(A8), the plurality of patches are arranged in a uniformly spaced array.

[0024] (A10) In some embodiments of (A7), wherein the plurality of patches include a first patch and a second patch, wherein the first patch has a first area and the second patch has a second area that is different from the first area.

[0025] (Al 1) In some embodiments of (A10), the first patch is adjacent to a center of the dielectric resonator; and the second patch is adjacent to an edge of the dielectric resonator.

[0026] (A12) In some embodiments of (Al 1), a distance between the second patch and the edge of the dielectric resonator is configured to avoid interference between the transmission signal transmitted by the dielectric antenna and an adjacent transmission of an adjacent antenna.

[0027] (A13) In some embodiments of (Al), the PCB includes a second transmission line that conducts a second transmission line that conducts a second power transmission signal, the first feed element includes a first contact, and the antenna includes a second feed element that includes a second contact. The first contact is separated from the second contact by a dielectric substrate material that surrounds the first contact. The second feed element is configured to (i) receive the second power transmission signal via the second transmission line and (ii) excite the dielectric resonator with the second power transmission signal.

[0028] (A14) In some embodiments of (A13), the first contact has a split ring shape.

[0029] (A15) In some embodiments of any of (A1)-(A14), the wireless power transmission antenna transmits the first transmission signal to a receiver that uses energy from the transmission signal to power or charge an electronic device coupled with the receiver.

[0030] (A16) In some embodiments of any of (A1)-(A15), a length of the wireless power transmission antenna is equal to or less than 40 mm.

[0031] (A17) In some embodiments of any of (A1)-(A16), the dielectric resonator includes a solid dielectric material.

[0032] (A18) In some embodiments of any of (A1)-(A17), the dielectric resonator includes a cavity.

[0033] (A19) In some embodiments of any of (A1)-(A18), the wireless power transmission antenna is one of a plurality of wireless power transmission antenna antennas mounted on the PCB.

[0034] (A20) In some embodiments, an electronic device has an integrated wireless power transmission antenna. The wireless power transmission antenna includes a printed circuit board (PCB) including a first transmission line that conducts a first power

transmission signal. The wireless power transmission antenna also includes a dielectric resonator that is mechanically coupled to the PCB and configured to radiate the first power transmission signal. The wireless power transmission antenna also includes a first feed element that is electronically coupled to the first transmission line and to the dielectric resonator. The first feed element is configured to receive the first power transmission signal via the first transmission line and excite the dielectric resonator with the first power transmission signal.

[0035] (A21) In some embodiments of (A20), the first feed element is a dipole element.

[0036] (A22) In some embodiments of (A20) or (A21), the mechanical coupling of the dielectric resonator to the PCB includes a mounting platform that is coupled to the dielectric resonator and to the PCB; and the mounting platform isolates at least a portion of the dipole element from the PCB.

[0037] (A23) In some embodiments of (A20), the PCB includes a plurality of patches.

Each respective patch of the plurality of patches is electronically coupled to a respective via of a plurality of vias, the respective via passing through the PCB to couple the respective patch with a ground plane that is coupled to the first transmission line of the PCB. In some embodiments, the first feed element is the plurality of patches. [0038] (A24) In some embodiments of (A20), the PCB includes a second

transmission line that conducts a second power transmission signal. The first feed element includes a first contact. The antenna includes a second feed element that includes a second contact, wherein the first contact is separated from the second contact by a dielectric substrate material that surrounds the first contact. The second feed element is configured to (i) receive the second power transmission signal via the second transmission line and (ii) excite the dielectric resonator with the second power transmission signal.

[0039] (A25) In some embodiments of (A24), the first contact has a split ring shape.

[0040] (A26) In some embodiments of any of (A20)-(A25), a length of the wireless power transmission antenna is equal to or less than 40 mm.

[0041] (A27) In some embodiments of any of (A20)-(A26), the dielectric resonator includes a solid dielectric material.

[0042] (A28) In some embodiments of any of (A20)-(A27), the dielectric resonator includes a cavity.

[0043] (A29) In some embodiments of any of (A20)-(A28), the wireless power transmission antenna is one of a plurality of wireless power transmission antennas included in the electronic device.

[0044] In some embodiments, a dipole feed antenna (i.e., an antenna that uses a dipole element as the feed element) for use in a wireless power transmission system includes a printed circuit board (PCB) that includes a transmission line. The transmission line receives a transmission signal for transmission by the antenna. A mounting platform is mechanically coupled to the PCB. A dielectric resonator is mechanically coupled to the mounting platform. At least one dipole element is electronically coupled to the transmission line and to the dielectric resonator. The at least one dipole element is configured to excite the dielectric resonator with a signal carried by the transmission line.

[0045] In some embodiments, a patch array feed dielectric antenna (i.e., an antenna that uses a plurality of patches of a patch array as the feed element) includes a printed circuit board (PCB) that includes a top surface and a bottom surface that is opposite the top surface. The bottom surface of the PCB is a ground plane that receives a transmission signal for transmission by the antenna. The top surface of the PCB includes a plurality of patches. A respective patch of the plurality of patches is electronically coupled to a via that passes through the PCB and electronically couples the respective patch to the ground plane. A dielectric resonator is electronically coupled to the plurality of patches. The plurality of patches excite the dielectric resonator with the transmission signal.

[0046] In some embodiments, a multi-contact antenna (i.e., an antenna that uses a split ring element which includes at least two contacts as the feed element) comprises a printed circuit board (PCB) that includes a first surface. The first surface of the PCB includes a first contact that is separated from a second contact by a dielectric substrate material. A first excitation slot is coupled to the first contact. A second excitation slot is coupled to the second contact. A first transmission signal is provided to the first contact via the first excitation slot. A second transmission signal is provided to the second contact via the second excitation slot. A dielectric resonator is electronically coupled to the first contact and the second contact. The first contact excites the dielectric resonator with the first transmission signal and the second contact excites the dielectric resonator with the second transmission signal.

[0047] Note that the various embodiments described above can be combined with any other embodiments described herein. The features and advantages described in the specification are not all inclusive and, in particular, many additional features and advantages will be apparent to one of ordinary skill in the art in view of the drawings, specification, and claims. Moreover, it should be noted that the language used in the specification has been principally selected for readability and instructional purposes, and may not have been selected to delineate or circumscribe the inventive subject matter.

BRIEF DESCRIPTION OF THE DRAWINGS

[0048] For a better understanding of the various described embodiments, reference should be made to the Detailed Description below, in conjunction with the following drawings in which like reference numerals refer to corresponding parts throughout the figures.

[0049] Figure 1 illustrates components of a wireless power transmission system, in accordance with some embodiments.

[0050] Figure 2 illustrates a representative housing structure with distributed isolating components in accordance with some embodiments.

[0051] Figures 3 A-3B illustrate another representative housing structure with distributed isolating components in accordance with some embodiments. [0052] Figures 4A-4B are flowcharts illustrating a method of constructing a transmitter in accordance with some embodiments.

[0053] Figure 5 illustrates a cross-sectional view of a microstrip antenna, in accordance with some embodiments.

[0054] Figure 6 illustrates a top view of a multi-layer PCB, in accordance with some embodiments.

[0055] Figure 7 is used to illustrate dimensions of a microstrip antenna, in accordance with some embodiments.

[0056] Figure 8 is an expanded view of a multi-layer PCB that illustrates a material formed on the interior surfaces of vias, in accordance with some embodiments.

[0057] Figure 9 illustrates an array of microstrip antennas, in accordance with some embodiments.

[0058] Figures 1 OA- IOC are a flowchart representation of a method for forming an antenna, in accordance with some embodiments.

[0059] Figure 11 is a block diagram of a surface mount antenna, in accordance with some embodiments.

[0060] Figures 12A-12B are schematics of a surface mount dielectric antenna with a solid dielectric resonator, in accordance with some embodiments.

[0061] Figure 13 is a schematic of a surface mount dielectric antenna with a hollow dielectric resonator, in accordance with some embodiments.

[0062] Figure 14 is a schematic of a surface mount dielectric antenna with a patch array feed, in accordance with some embodiments.

[0063] Figures 15A-15B are illustrative configurations of a surface mount dielectric antenna with a patch array feed, in accordance with some embodiments.

[0064] Figure 16 is a schematic of a surface mount dielectric antenna with a split ring feed, in accordance with some embodiments.

[0065] Figure 17 illustrates an x-axis dimension and a y-axis dimension of a surface mount dielectric antenna, in accordance with some embodiments.

[0066] In accordance with common practice, the various features illustrated in the drawings may not be drawn to scale. Accordingly, the dimensions of the various features may be arbitrarily expanded or reduced for clarity. In addition, some of the drawings may not depict all of the components of a given system, method or device. Finally, like reference numerals may be used to denote like features throughout the specification and figures.

DETAILED DESCRIPTION

[0067] Reference will now be made in detail to embodiments, examples of which are illustrated in the accompanying drawings. In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the various described embodiments. However, it will be apparent to one of ordinary skill in the art that the various described embodiments may be practiced without these specific details. In other instances, well-known methods, procedures, components, circuits, and networks have not been described in detail so as not to unnecessarily obscure aspects of the embodiments.

[0068] The embodiments of the present disclosure include different types of structures with distributed (e.g., periodic) wires or other separating materials surrounding antennas. In some instances, the distributed wires reduce mutual coupling between different antennas in an array attached to a structure. In some embodiments, a metallic structure is used with metal poles placed between each of several antennas, which are elevated from the bottom of the metallic structure. In some embodiments, the metallic structure is used to hold several antennas for wireless power transmission and/or reception.

[0069] Mutual coupling includes the electromagnetic interaction between antenna elements, which are in the same array or on nearby arrays. In some instances, current created for transmission, or received via electromagnetic transmission, is affected by mutual coupling from other antennas. In accordance with various embodiments, wires, poles, nails, and the like are used as isolating components to reduce the mutual coupling between the antennas. Similarly, in some embodiments, the elevation of different antennas is optimized for mutual coupling reduction as well as transmission/reception at certain frequencies and wavelengths. In various embodiments, the antennas include surface mount dielectric resonator antennas, microstrip antennas, and the like.

[0070] As used herein, a "transmitter" refers to a device (e.g., including a chip) that transmits, and optionally generates, electromagnetic wave(s), such as radio-frequency (RF) waves. In some embodiments, at least one RF wave is phase shifted and gain adjusted with respect to other RF waves, and substantially all of the waves pass through one or more antennas. In some embodiments, the waves are directed to a target receiver device. In some embodiments, the waves are broadcast to any electronic device in the vicinity of the transmitter. Example transmitters are described in greater detail below with reference to Figure 1.

[0071] In some embodiments, a receiver comprises an electronic device including at least one antenna, at least one rectifying circuit, and at least one power converter, which optionally utilizes a pocket of energy for powering or charging the electronic device.

Example receivers are described in greater detail below with reference to Figure 1.

[0072] As used herein, "pocket-forming" refers to generating one or more RF waves that converge in a transmission field, forming controlled pocket of energy and null space in the transmission field. As used herein, a "pocket of energy" refers to an area or region of space where energy accumulates based on a convergence of waves that constructively interfere at that area or region. In some instances and embodiments, constructive interference occurs when the waves converge and their respective waveform characteristics coalesce, thereby augmenting the amount of energy concentrated at the particular location where the waves converge. As used herein, "null-space" refers to areas or regions of space where pockets of energy do not form, which may be caused by destructive interference of waves at that area or region. In some instances, destructive interference occurs when waves converge and their respective waveform characteristics are opposite of each other, thereby cancelling out the amount of energy concentrated at the particular location where the waves converge.

[0073] In some instances, a pocket of energy forms at locations of constructive interference patterns of power waves transmitted by the transmitter. In some instances and embodiments, the pockets of energy manifest as a three-dimensional field where energy may be harvested by receivers located within, or proximate to, the pockets of energy. In some embodiments, the pockets of energy produced by transmitters are harvested by a receiver, converted to an electrical charge, and then provided to an electronic device (e.g., laptop computer, smartphone, rechargeable battery) coupled to the receiver. In some embodiments, multiple transmitters and/or multiple receivers concurrently power various electronic devices. In some embodiments, the receiver is separable from the electronic device while in other embodiments, the receiver is integrated with the electronic device.

[0074] In some embodiments, transmitters perform adaptive pocket forming processes. In some embodiments, performing adaptive pocket forming processes includes adjusting transmission of the power waves in order to regulate power levels (e.g., based on data from one or more sensors). In some embodiments, the adaptive pocket forming processes adjust one or more characteristics used to transmit power waves (e.g., amplitude, frequency, phase, etc.) and/or reduce a power level (e.g., power density) of power waves transmitted to a given location. For example, in response to sensor readings that indicate a living being or sensitive object in proximity to a particular location or region in space, a transmitter, using an adaptive pocket-forming process, may reduce the power level of power waves converging at the location, thereby reducing or altogether eliminating the amount of energy at that location. In some embodiments, an adaptive pocket forming process uses destructive interference to diminish, reduce, or prevent the energy of power waves from concentrating at a particular location. For example, a transmitter may use destructive inference to diminish the energy concentrated at the location of an object, where the object is identified or tagged in a database to be excluded from receipt of power waves.

[0075] In some embodiments, the adaptive pocket forming transmitter uses a combination of the above techniques in response to data from one or more sensors. In some embodiments, the transmitter is coupled to sensors configured to detect presence and/or motion of objects. In some embodiments, the transmitter is coupled to sensors configured to recognize (e.g., via an image sensor) and/or identify particular objects (e.g., via RFID protocols). For example, a transmitter selectively reduces the power level of power waves at a particular location when data from one or more sensors indicates the presence and/or movement of a sensitive object, such as a human being, at or near the particular location so as to diminish or eliminate one or more pockets of energy at the particular location. In some embodiments, the transmitter terminates or adjusts the power waves when location data from sensors indicates arrival or anticipated arrival of a sensitive object within a predetermined distance (e.g., a distance within a range of 1-5 feet) of a particular location having one or more pockets of energy. In some embodiments, the transmitter reduces or terminates transmitting power waves to a particular location in accordance with a determination that a sensitive object is within the predetermined distance of the particular location or approaching the particular location.

[0076] In some embodiments, communications signals are produced by the receiver and/or the transmitter using an external power supply and a local oscillator chip. In some embodiments, the communication signals are produced using a piezoelectric material. In various embodiments, the communications signals are RF waves or any other communication medium or protocol capable of communicating data between processors, such as Bluetooth®, wireless fidelity (Wi-Fi), radio-frequency identification (RFID), infrared, near-field communication (NFC), ZigBee, and others. In some embodiments, such communications signals are used to convey information between the transmitter and the receiver. In some embodiments, the conveyed information is used to adjust the power waves. In some embodiments, the conveyed information includes one or more of information related to status, efficiency, user data, power consumption, billing, geo-location, and similar types of information.

REPRESENTATIVE WIRELESS CHARGING SYSTEM

[0077] Figure 1 is a block diagram of components of wireless power transmission environment 100, in accordance with some embodiments. Wireless power transmission environment 100 includes, for example, transmitters 102 (e.g., transmitters 102a, 102b ... 102n) and one or more receivers 120 (e.g., receivers 120a, 120b ... 120n). In some embodiments, each respective wireless power transmission environment 100 includes a number of receivers 120, each of which is associated with a respective electronic device 122.

[0078] An example transmitter 102 (e.g., transmitter 102a) includes, for example, one or more processor(s) 104, a memory 106, one or more antenna arrays 110 (e.g., including antenna elements structured as described below in reference to Figures 5- IOC), and one or more communications components 112, and/or one or more transmitter sensors 114. In some embodiments, these components are interconnected by way of a communications bus 108. References to these components of transmitters 102 cover embodiments in which one or more than one of each of these components (and combinations thereof) are included.

[0079] In some embodiments, memory 106 stores one or more programs (e.g., sets of instructions) and/or data structures, collectively referred to as "modules" herein. In some embodiments, memory 106, or the non-transitory computer readable storage medium of memory 106 stores the following modules 107 (e.g., programs and/or data structures), or a subset or superset thereof:

• information received from receiver 120 (e.g., generated by receiver sensor 128 and then transmitted to the transmitter 102a);

• information received from transmitter sensor 114;

• an adaptive pocket-forming module that adjusts one or more power waves transmitted by one or more transmitters 102; and/or

• a beacon transmitting module that transmits a communication signal 118 for detecting a receiver 120 (e.g., within a transmission field of the one or more transmitters 102). [0080] The above-identified modules (e.g., data structures and/or programs including sets of instructions) need not be implemented as separate software programs, procedures, or modules, and thus various subsets of these modules may be combined or otherwise rearranged in various embodiments. In some embodiments, memory 106 stores a subset of the modules identified above. In some embodiments, an external mapping memory 131 that is communicatively connected to communications component 112 stores one or more modules identified above. Furthermore, the memory 106 and/or external mapping memory 131 may store additional modules not described above. In some embodiments, the modules stored in memory 106, or a non-transitory computer readable storage medium of memory 106, provide instructions for implementing respective operations in the methods described below. In some embodiments, some or all of these modules may be implemented with specialized hardware circuits that subsume part or all of the module functionality. One or more of the above- identified elements may be executed by one or more of processor(s) 104. In some embodiments, one or more of the modules described with regard to memory 106 is implemented on memory 104 of a server (not shown) that is communicatively coupled to one or more transmitters 102 and/or by a memory of electronic device 122 and/or receiver 120.

[0081] In some embodiments, a single processor 104 (e.g., processor 104 of transmitter 102a) executes software modules for controlling multiple transmitters 102 (e.g., transmitters 102b . . . 102n). In some embodiments, a single transmitter 102 (e.g., transmitter 102a) includes multiple processors 104, such as one or more transmitter processors

(configured to, e.g., control transmission of signals 116 by antenna array 110), one or more communications component processors (configured to, e.g., control communications transmitted by communications component 112 and/or receive communications by way of communications component 112) and/or one or more sensor processors (configured to, e.g., control operation of transmitter sensor 114 and/or receive output from transmitter sensor 114).

[0082] Receiver 120 (e.g., a receiver of electronic device 122) receives power signals

116 and/or communications 118 transmitted by transmitters 102. In some embodiments, receiver 120 includes one or more antennas 124 (e.g., antenna array including multiple antenna elements), power converter 126, receiver sensor 128 and/or other components or circuitry (e.g., processor(s) 140, memory 142, and/or communication component(s) 144). In some embodiments, these components are interconnected by way of a communications bus 143. References to these components of receiver 120 cover embodiments in which one or more than one of each of these components (and combinations thereof) are included.

Receiver 120 converts energy from received signals 116 (e.g., power waves) into electrical energy to power and/or charge electronic device 122. For example, receiver 120 uses power converter 126 to convert captured energy from power waves 116 to alternating current (AC) electricity or direct current (DC) electricity usable to power and/or charge electronic device 122. Non-limiting examples of power converter 126 include rectifiers, rectifying circuits, voltage conditioners, among suitable circuitry and devices.

[0083] In some embodiments, receiver 120 is a standalone device that is detachably coupled to one or more electronic devices 122. For example, electronic device 122 has processor(s) 132 for controlling one or more functions of electronic device 122 and receiver 120 has processor(s) 140 for controlling one or more functions of receiver 120.

[0084] In some embodiments, receiver is a component of electronic device 122. For example, processor(s) 132 controls functions of electronic device 122 and receiver 120.

[0085] In some embodiments, electronic device 122 includes processor(s) 132, memory 134, communication component(s) 136, and/or battery/batteries 130. In some embodiments, these components are interconnected by way of a communications bus 138. In some embodiments, communications between electronic device 122 and receiver 120 occur via communications component(s) 136 and/or 144. In some embodiments, communications between electronic device 122 and receiver 120 occur via a wired connection between communications bus 138 and communications bus 146. In some embodiments, electronic device 122 and receiver 120 share a single communications bus.

[0086] In some embodiments, receiver 120 receives one or more power waves 116 directly from transmitter 102. In some embodiments, receiver 120 harvests power waves from one or more pockets of energy created by one or more power waves 116 transmitted by transmitter 102.

[0087] In some embodiments, after the power waves 116 are received and/or energy is harvested from a pocket of energy, circuitry (e.g., integrated circuits, amplifiers, rectifiers, and/or voltage conditioner) of the receiver 120 converts the energy of the power waves (e.g., radio frequency electromagnetic radiation) to usable power (i.e., electricity), which powers electronic device 122 and/or is stored to battery 130 of electronic device 122. In some embodiments, a rectifying circuit of the receiver 120 translates the electrical energy from AC to DC for use by electronic device 122. In some embodiments, a voltage conditioning circuit increases or decreases the voltage of the electrical energy as required by the electronic device 122. In some embodiments, an electrical relay conveys electrical energy from the receiver 120 to the electronic device 122.

[0088] In some embodiments, receiver 120 is a component of an electronic device

122. In some embodiments, a receiver 120 is coupled (e.g., detachably coupled) to an electronic device 122. In some embodiments, electronic device 122 is a peripheral device of receiver 120. In some embodiments, electronic device 122 obtains power from multiple transmitters 102 and/or using multiple receivers 120. In some embodiments, the wireless power transmission environment 100 includes a plurality of electronic devices 122, each having at least one respective receiver 120 that is used to harvest power waves from the transmitters 102 into usable power for charging the electronic devices 122.

[0089] In some embodiments, the one or more transmitters 102 adjust one or more characteristics (e.g., phase, gain, direction, and/or frequency) of power waves 116. For example, a transmitter 102 (e.g., transmitter 102a) selects a subset of one or more antenna elements of antenna array 110 to initiate transmission of power waves 116, cease

transmission of power waves 116, and/or adjust one or more characteristics used to transmit power waves 116. In some implementations, the one or more transmitters 102 adjust power waves 1 16 such that trajectories of power waves 116 converge at a predetermined location within a transmission field (e.g., a location or region in space), resulting in controlled constructive or destructive interference patterns.

[0090] In some embodiments, respective antenna arrays 110 of the one or more transmitters 102 may include a set of one or more antennas configured to transmit the power waves 116 into respective transmission fields of the one or more transmitters 102. Integrated circuits (not shown) of the respective transmitter 102, such as a controller circuit and/or waveform generator, may control the behavior of the antennas. For example, based on the information received from the receiver by way of the communications signal 118, a controller circuit may determine a set of one or more characteristics or waveform characteristics (e.g., amplitude, frequency, trajectory, phase, among other characteristics) used for transmitting the power waves 116 that would effectively provide power to the receiver 102 and electronic device 122. The controller circuit may also identify a subset of antennas from the antenna arrays 110 that would be effective in transmitting the power waves 116. As another example, a waveform generator circuit of the respective transmitter 102 coupled to the processor 104 may convert energy and generate the power waves 116 having the waveform characteristics identified by the controller, and then provide the power waves to the antenna arrays 110 for transmission.

[0091] In some embodiments, constructive interference of power waves occurs when two or more power waves 116 are in phase with each other and converge into a combined wave such that an amplitude of the combined wave is greater than amplitude of a single one of the power waves. For example, the positive and negative peaks of sinusoidal waveforms arriving at a location from multiple antennas "add together" to create larger positive and negative peaks. In some embodiments, a pocket of energy is formed at a location in a transmission field where constructive interference of power waves occurs.

[0092] In some embodiments, destructive interference of power waves occurs when two or more power waves are out of phase and converge into a combined wave such that the amplitude of the combined wave is less than the amplitude of a single one of the power waves. For example, the power waves "cancel each other out," thereby diminishing the amount of energy concentrated at a location in the transmission field. In some embodiments, destructive interference is used to generate a negligible amount of energy or "null" at a location within the transmission field where the power waves converge.

[0093] In some embodiments, the one or more transmitters 102 transmit power waves

116 that create two or more discrete transmission fields (e.g., overlapping and/or non- overlapping discrete transmission fields). In some embodiments, a first transmission field is managed by a first processor 104 of a first transmitter (e.g. transmitter 102a) and a second transmission field is managed by a second processor 104 of a second transmitter (e.g., transmitter 102b). In some embodiments, the two or more discrete transmission fields (e.g., overlapping and/or non-overlapping) are managed by the transmitter processors 104 as a single transmission field.

[0094] In some embodiments, communications component 112 transmits

communication signals 118 by way of a wired and/or wireless communication connection to receiver 120. In some embodiments, communications component 112 generates

communications signals 118 used for triangulation of receiver 120. In some embodiments, communication signals 118 are used to convey information between transmitter 102 and receiver 120 for adjusting one or more characteristics used to transmit the power waves 116. In some embodiments, communications signals 118 include information related to status, efficiency, user data, power consumption, billing, geo-location, and other types of information. [0095] In some embodiments, receiver 120 includes a transmitter (not shown), or is a part of a transceiver, that transmits communications signals 118 to communications component 112 of transmitter 102.

[0096] In some embodiments, communications component 112 (e.g., communications component 112 of transmitter 102a) includes a communications component antenna for communicating with receiver 120 and/or other transmitters 102 (e.g., transmitters 102b through 102n). In some embodiments, these communications signals 118 represent a distinct channel of signals transmitted by transmitter 102, independent from a channel of signals used for transmission of the power waves 116.

[0097] In some embodiments, the receiver 120 includes a receiver-side

communications component (not shown) configured to communicate various types of data with one or more of the transmitters 102, through a respective communications signal 118 generated by the receiver-side communications component. The data may include location indicators for the receiver 102 and/or electronic device 122, a power status of the device 122, status information for the receiver 102, status information for the electronic device 122, status information about the power waves 116, and/or status information for pockets of energy. In other words, the receiver 102 may provide data to the transmitter 102, by way of the communications signal 118, regarding the current operation of the system 100, including: information identifying a present location of the receiver 102 or the device 122, an amount of energy received by the receiver 120, and an amount of power received and/or used by the electronic device 122, among other possible data points containing other types of

information.

[0098] In some embodiments, the data contained within communications signals 118 is used by electronic device 122, receiver 120, and/or transmitters 102 for determining adjustments of the one or more characteristics used by the antenna array 110 to transmit the power waves 106. Using a communications signal 118, the transmitter 102 communicates data that is used, e.g., to identify receivers 120 within a transmission field, identify electronic devices 122, determine safe and effective waveform characteristics for power waves, and/or hone the placement of pockets of energy. In some embodiments, receiver 120 uses a communications signal 118 to communicate data for, e.g., alerting transmitters 102 that the receiver 120 has entered or is about to enter a transmission field, provide information about electronic device 122, provide user information that corresponds to electronic device 122, indicate the effectiveness of received power waves 116, and/or provide updated characteristics or transmission parameters that the one or more transmitters 102 use to adjust transmission of the power waves 116.

[0099] As an example, the communications component 112 of the transmitter 102 communicates (e.g., transmits and/or receives) one or more types of data (including, e.g., authentication data and/or transmission parameters) including various information such as a beacon message, a transmitter identifier, a device identifier for an electronic device 122, a user identifier, a charge level for electronic device 122, a location of receiver 120 in a transmission field, and/or a location of electronic device 122 in a transmission field.

[00100] In some embodiments, transmitter sensor 114 and/or receiver sensor 128 detect and/or identify conditions of electronic device 122, receiver 120, transmitter 102, and/or a transmission field. In some embodiments, data generated by transmitter sensor 114 and/or receiver sensor 128 is used by transmitter 102 to determine appropriate adjustments to the one or more characteristics used to transmit the power waves 106. Data from transmitter sensor 114 and/or receiver sensor 128 received by transmitter 102 includes, e.g., raw sensor data and/or sensor data processed by a processor 104, such as a sensor processor. Processed sensor data includes, e.g., determinations based upon sensor data output. In some

embodiments, sensor data received from sensors that are external to the receiver 120 and the transmitters 102 is also used (such as thermal imaging data, information from optical sensors, and others).

[00101] In some embodiments, receiver sensor 128 is a gyroscope that provides raw data such as orientation data (e.g., tri-axial orientation data), and processing this raw data may include determining a location of receiver 120 and/or or a location of receiver antenna 124 using the orientation data.

[00102] In some embodiments, receiver sensor 128 includes one or more infrared sensors (e.g., that output thermal imaging information), and processing this infrared sensor data includes identifying a person (e.g., indicating presence of the person and/or indicating an identification of the person) or other sensitive object based upon the thermal imaging information.

[00103] In some embodiments, receiver sensor 128 includes a gyroscope and/or an accelerometer that indicates an orientation of receiver 120 and/or electronic device 122. As one example, transmitters 102 receive orientation information from receiver sensor 128 and the transmitters 102 (or a component thereof, such as the processor 104) use the received orientation information to determine whether electronic device 122 is flat on a table, in motion, and/or in use (e.g., next to a user's head).

[00104] In some embodiments, receiver sensor 128 is a sensor of electronic device 122

(e.g., an electronic device 122 that is remote from receiver 102). In some embodiments, receiver 120 and/or electronic device 122 includes a communication system for transmitting signals (e.g., sensor signals output by receiver sensor 128) to transmitter 102.

[00105] Non-limiting examples of transmitter sensor 114 and/or receiver sensor 128 include, e.g., infrared, pyroelectric, ultrasonic, laser, optical, Doppler, gyro, accelerometer, microwave, millimeter, RF standing-wave sensors, resonant LC sensors, capacitive sensors, and/or inductive sensors. In some embodiments, technologies for transmitter sensor 114 and/or receiver sensor 128 include binary sensors that acquire stereoscopic sensor data, such as the location of a human or other sensitive object.

[00106] In some embodiments, transmitter sensor 114 and/or receiver sensor 128 is configured for human recognition (e.g., capable of distinguishing between a person and other objects, such as furniture). Examples of sensor data output by human recognition-enabled sensors include: body temperature data, infrared range-finder data, motion data, activity recognition data, silhouette detection and recognition data, gesture data, heart rate data, portable devices data, and wearable device data (e.g., biometric readings and output, accelerometer data).

[00107] In some embodiments, transmitters 102 adjust one or more characteristics used to transmit the power waves 116 to ensure compliance with electromagnetic field (EMF) exposure protection standards for human subjects. Maximum exposure limits are defined by US and European standards in terms of power density limits and electric field limits (as well as magnetic field limits). These include, for example, limits established by the Federal Communications Commission (FCC) for maximum permissible exposure (MPE), and limits established by European regulators for radiation exposure. Limits established by the FCC for MPE are codified at 47 CFR § 1.1310. For electromagnetic field (EMF) frequencies in the microwave range, power density can be used to express an intensity of exposure. Power density is defined as power per unit area. For example, power density can be commonly expressed in terms of watts per square meter (W/m2), milliwatts per square centimeter (mW/cm2), or microwatts per square centimeter In some embodiments, output from transmitter sensor 114 and/or receiver sensor 128 is used by transmitter 102 to detect whether a person or other sensitive object enters a power transmission region (e.g., a location within a predetermined distance of a transmitter 102, power waves generated by transmitter 102, and/or a pocket of energy). In some embodiments, in response to detecting that a person or other sensitive object has entered the power transmission region, the transmitter 102 adjusts one or more power waves 116 (e.g., by ceasing power wave transmission, reducing power wave transmission, and/or adjusting the one or more characteristics of the power waves). In some embodiments, in response to detecting that a person or other sensitive object has entered the power transmission region, the transmitter 102 activates an alarm (e.g., by transmitting a signal to a loudspeaker that is a component of transmitter 102 or to an alarm device that is remote from transmitter 102). In some embodiments, in response to detecting that a person or other sensitive object has entered a power transmission region, the transmitter 102 transmits a digital message to a system log or administrative computing device.

[00108] In some embodiments, antenna array 110 includes multiple antenna elements

(e.g., configurable "tiles") collectively forming an antenna array. Antenna array 110 generates power transmission signals, e.g., RF power waves, ultrasonic power waves, infrared power waves, and/or magnetic resonance power waves. In some embodiments, the antennas of an antenna array 110 (e.g., of a single transmitter, such as transmitter 102a, and/or of multiple transmitters, such as transmitters 102a, 102b, ... , 102n) transmit two or more power waves that intersect at a defined location (e.g.,. a location corresponding to a detected location of a receiver 120), thereby forming a pocket of energy (e.g., a concentration of energy) at the defined location.

[00109] In some embodiments, transmitter 102 assigns a first task to a first subset of antenna elements of antenna array 110, a second task to a second subset of antenna elements of antenna array 110, and so on, such that the constituent antennas of antenna array 110 perform different tasks (e.g., determining locations of previously undetected receivers 120 and/or transmitting power waves 116 to one or more receivers 120). As one example, in an antenna array 110 with ten antennas, nine antennas transmit power waves 116 that form a pocket of energy and the tenth antenna operates in conjunction with communications component 112 to identify new receivers in the transmission field. In another example, an antenna array 110 having ten antenna elements is split into two groups of five antenna elements, each of which transmits power waves 116 to two different receivers 120 in the transmission field.

[00110] In some embodiments, a microstrip antenna 500 (of Figure 5) is an antenna element of antenna array 110 of transmitter 102. In some embodiments, a microstrip antenna 500 is an antenna element of antenna 124 of receiver 120. Microstrip antenna 500 transmits and/or receives electromagnetic waves.

[00111] In some embodiments, a surface mount dielectric antenna 150 (e.g., antenna

1200, 1300, 1400, and/or 1500 as described below) is an antenna element of antenna array 110 of transmitter 102. In some embodiments, a surface mount dielectric antenna 1150 (e.g., antenna 1200, 1300, 1400, and/or 1500 as described below) is an antenna element of antenna 124 of receiver 120.

REPRESENTATIVE HOUSING STRUCTURES

[00112] Figure 2 illustrates a representative housing structure 300 (e.g., metallic structure) with isolating components (e.g., distributed metallic wires) in accordance with some embodiments. In accordance with some embodiments, the housing structure 300 includes isolating components 302, antenna 304, and base 306. In some embodiments, the base 306 comprises a conductive surface (e.g., a metallic surface). In various embodiments, the housing structure 300 utilizes pins, screws, wires, and/or conductive bars or cylinders as the isolating components 302 in order to increase isolation between antenna 304 and another antenna. In various embodiments, the isolating components 302 are comprised of a conductive material, such as carbon steel, stainless steel, brass, nickel alloy, and/or aluminum alloys. In some embodiments, the isolating components are arranged at set intervals around the antenna 304. In some embodiments, the isolating components are arranged at irregular intervals around the antenna 304. In some embodiments, the isolating components 302 are arranged so as to separate/isolate two or more antennas, but do not completely surround either antenna. In some embodiments, the isolating components 302 are arranged on the housing structure 300 so as to separate two or more antennas and reduce coupling between the antennas. In various embodiments, the antenna 304 comprises a surface mounted dielectric resonator antenna, a surface mounted dielectric resonator antenna with a hollowed core, and/or a microstrip antenna. In some embodiments, 900 megahertz may be used as a frequency for receiving or transmitting.

[00113] In some embodiments, the isolating components 302 are elevated from the base 306. In some embodiments, the height of individual isolating components (e.g., wires or bars) is optimized to reduce and/or alter antenna coupling. In some embodiments, the radius of antenna 304 is increased, or reduced, to modify the coupling between antennas. In some embodiments, the isolating components 302 are passive. In some embodiments, the isolating components 302 utilize a separate source of current than is used to provide power to the antenna 304. In some embodiments, the isolating components 302, the housing structure 300, and/or the base 306 are coupled to one or more ground planes. In some embodiments, the housing structure 300 includes one or more antennas which form an antenna array. In various embodiments, the antennas are arranged in a periodic or non-periodic pattern. For example, a housing structure 300 with a grid of 2 x 2, 16 x 16, 8 x 32, etc. of antennas optionally includes isolating components 302 for each section of the grid. In some embodiments, each section of the grid is referred to as a respective region of the housing structure. In some embodiments, some of the isolating components configured to isolate a first antenna are distinct from the isolating components configured to isolate a second antenna of the housing structure 300. In some embodiments, isolating components for each antenna are configured based on the respective antenna (e.g., the height of individual isolating components is based on a frequency used by the antenna), such that the housing structure 300 includes a first set of isolating components having first characteristics and a second set of isolating components having second characteristics distinct from the first characteristics.

[00114] In some embodiments, based on (1) a type of antenna(s) in an antenna array,

(2) a size of the antenna(s), and/or (3) a frequency of operation for the antenna(s), certain characteristics of the antenna array are optimized accordingly. In some embodiments, the certain characteristics include one or more of: (a) a size of isolating components in the antenna array, (b) a height of the isolating components, (c) a number of the isolating components, and (d) a gap between the antennas and a back reflector. As one, non-limiting example, the components (e.g., the isolating components) are smaller in antenna arrays that are configured to transmit at higher frequencies as compared to antenna arrays that are configured to transmit at lower frequencies (e.g., first components of a first antenna array configured to transmit at 2.4 GHz are smaller than second components of a second antenna array configured to transmit at 900 MHz). In some embodiments, respective antenna arrays (which may be transmitting at various respective frequencies) and their corresponding housing structures comprise a tightly coupled system and the entire system is optimized together to achieve an optimal configuration for transmitting at a particular frequency.

[00115] In some embodiments, the antenna(s) 304 have non-rectangular shapes, such as circles, polygons, or irregular shapes. In some embodiments, the isolating components 302 surround the antennas by conforming to each antenna's respective shape. In some embodiments where the antennas are rectangular, the isolating components 302 surround the antennas on four sides. In some embodiments where the antennas are circular, the antennas are surrounded in the shape of a circle formed by the isolating components 302. In some embodiments, the isolating components 302 have a uniform size and/or shape, while in other embodiments, the isolating components 302 have multiple sizes and/or shapes. In some embodiments, the isolating components 302 are made of a uniform substance (e.g., brass), while in other embodiments, the isolating components 302 are made of multiple substances (e.g., brass and steel). In some embodiments, the isolating components 302 have an irregular shape. For example, the isolating components 302 have a larger surface further away from the base 306.

[00116] In some embodiments, the base 306 is coupled to (e.g., attached to) ground. In some embodiments, the base 306 is coupled to a circuit that includes a separate electric current, different from the antennas. In some embodiments, transmission wires are run through or above the base 306 and attached to the antenna(s) 304. In some embodiments, the antenna 304 is used for wireless power receiving and/or transmitting in accordance with the embodiments described above with respect to Figure 1.

[00117] Figures 3A-3B illustrate a representative housing structure 400 with distributed isolating components 302 in accordance with some embodiments. In Figure 3A, the housing structure 300 comprises a metallic structure with isolating components 302 (e.g., periodic metallic wires) and a base 306. Figure 3A also shows regions 402, 404, and 406 defined by the isolating components 302. In accordance with some embodiments, the regions 402, 404, and 406 are physically separated by respective subsets of the isolating components 302 so as to reduce mutual coupling between antennas mounted in the regions 402, 404, and 406.

[00118] In some embodiments, the housing structure 300 uses pins, screws or metal bars/cylinders as isolating components to increase isolation between one antenna and another antenna (e.g., another antenna on the housing structure 300). In various embodiments, the isolating components 302 are comprised of any medium, such as carbon steel wire, stainless steel, brass, nickel alloy and/or aluminum alloys. In some embodiments, the isolating components 302 are arranged/configured to separate two or more antennas in order to reduce coupling between the antennas. In some embodiments, respective sets of isolating components 302 separate each respective antenna, such that a first antenna is placed within a first set of isolating components (i.e., each isolating component in this first set surrounds a perimeter of the first antenna) and a second antenna is placed within a second set of isolating components (i.e., each isolating component in the second set surrounds a perimeter of the second antenna).

[00119] In some embodiments, the isolating components 302 are elevated from the base 306. In some embodiments, the height of wires or bars composing the isolating components 302 are optimized to reduce and/or alter coupling effects between respective antennas. In some embodiments, the housing structure 300 includes several antennas (e.g., 3 antennas) separated by the isolating components 302. In various embodiments, the antennas are arranged in a periodic or non-periodic pattern. For example, a housing structure 300 with a grid of 2 x 2, 16 x 16, 8 x 32, etc. for antennas optionally includes isolating components 302 outlining each section of the grid. In some embodiments, the isolating components 302 are configured to surround or outline respective perimeters of respective antennas that have multiple distinct shapes (e.g., distinct geometric and/or irregular shapes).

[00120] In Figure 3B, the housing structure 400 includes isolating components 302, antenna(s) 304, and a base 306. In some embodiments, the housing structure 400 uses pins, screws or metal bars/cylinders as isolating components to increase isolation between one antenna and another antenna (e.g., another antenna on the housing structure 400). In various embodiments, the isolating components 302 are comprised of any medium, such as carbon steel wire, stainless steel, brass, nickel alloy and/or aluminum alloys. In some embodiments, the isolating components 302 are arranged/configured to separate two or more antennas in order to reduce coupling between the antennas.

[00121] As shown in Figure 3B, the antenna 304 is placed in region 404 (shown in

Figure 3 A) within a first set of isolating components 302, such that a perimeter of the antenna 304 is surrounded by the first set of isolating components. Figure 3B also shows that two other regions 402 and 406 of the housing structure 400 are available to receive additional antennas and these two other regions 402 and 406 are defined by respective sets of isolating components, so that after respective antennas are placed within the two other regions, the sets of isolating components create gaps between all antennas that are included within the housing structure 400. In this way, mutual coupling effects between the antennas are reduced are wireless power transmission efficiencies and performance are improved as a higher percentage energy associated with transmitted power waves is sent into a transmission field of the transmitter instead of being wasted due to mutual coupling effects. REPRESENTATIVE PROCESSES (I)

[00122] Attention is now directed to the flowchart representations of Figures 4A-4B.

Figures 4A-4B are flowcharts illustrating a method 550 of constructing a transmitter in accordance with some embodiments.

[00123] At least two antennas (e.g., antenna(s) 110, Figure 1) are provided (552), the at least two antennas configured to direct electromagnetic waves toward a wireless power receiver such that the electromagnetic waves interfere constructively at a location proximate to the wireless power receiver. In some embodiments, the at least two antennas include one or more of: a surface-mounted dielectric resonator antenna; a surface-mounted dielectric resonator antenna with a hollowed core; and a microstrip antenna.

[00124] A housing structure (e.g., housing structure 400, Figure 3A) is provided (554), the housing structure configured to receive the at least two antennas. In some embodiments, the housing structure comprises a metallic structure.

[00125] The housing structure includes (556): (1) a metallic base; (2) a first set of isolating components extending upwardly relative to the metallic base and defining a first region of the housing structure that is configured to receive a first antenna of the at least two antennas; and (3) a second set of isolating components extending upwardly relative to the metallic base and defining a second region of the housing structure that is configured to receive a second antenna of the at least two antennas, the second set including at least some isolating components distinct from those in the first set. For example, Figure 3B shows a housing structure 400 with a metallic base 306, a subset of isolating components 302 surrounding the antenna 304, and a subset of the isolating components 302 defining the region 402 to the left of the antenna 304.

[00126] The first and second sets of isolating components are configured (558) to

(i) create a physical gap in the housing structure between the first and second antennas and

(ii) reduce a mutual coupling between the first antenna and the second antenna. Figure 3 A shows the isolating components 302 separating regions 402, 404, and 406, thereby creating a physical gap and reducing mutual coupling in accordance with some embodiments.

[00127] The first antenna is mounted (560) at the first region of the housing structure.

For example, Figure 3B shows the antenna 304 mounted in the region 404 (shown in Figure 3A). [00128] A first perimeter of the first antenna is surrounded (562) by the first set of isolating components. For example, Figure 3B shows a perimeter of antenna 304 surrounded by a subset of isolating components 302.

[00129] The second antenna is mounted (564) at the second region of the housing structure. For example, in accordance with some embodiments, a second antenna is mounted in region 402 or 406 shown in Figure 3B.

[00130] A second perimeter of the second antenna is surrounded (566) by the second set of isolating components.

[00131] In some embodiments, the first antenna and the second antenna (e.g., antenna(s) 110 in Figure 1) are coupled (568) to one or more processors configured to govern operation of the first antenna and the second antenna. For example, antenna(s) 110 in Figure 1 are coupled to processor(s) 104 via communications bus 108.

[00132] In some embodiments, power is supplied (570) to the first antenna and the second antenna using a first power source; and power is supplied to the first and second sets of isolating components, via the metallic base, using a second power source, distinct from the first power source.

[00133] In some embodiments, the plurality of isolating components (e.g., isolating components 302, Figure 3A) is coupled (572) to an electrical ground. For example, the metallic base is grounded thereby grounding the isolating components.

REPRESENTATIVE MICROSTRIP ANTENNA

[00134] Figure 5 illustrates a cross-sectional view of a microstrip antenna 500, in accordance with some embodiments. In some embodiments, the microstrip antenna 500 includes a first multi-layer printed circuit board (PCB) 502, a second multi-layer PCB 504, and a dielectric slab 506. In some embodiments, the first multi-layer PCB 502 includes first PCB 508. In some embodiments, the first PCB 508 includes electrically conductive material at the top side of first PCB 508 (e.g., a first layer 510 of the electrically conductive material) and at the bottom side of first PCB 508 (e.g., a second layer 512 of the electrically conductive material). In some embodiments, the second multi-layer PCB 504 includes second PCB 514. In some embodiments, the second PCB 514 includes electrically conductive material at the top side of second PCB 514 (e.g., a first layer 516 of the electrically conductive material) and at the bottom side of second PCB 514 (e.g., a second layer 518 of the electrically conductive material). In some embodiments, the electrically conductive material is a metal, for example, copper, silver, gold, aluminum, and/or brass. In some embodiments, the electrically conductive material is laminated on tops and/or bottoms of the PCBs 508 and 514 during manufacture of the first multi-layer PCB 502 and the second multi-layer PCB 504.

[00135] In some embodiments, a first set of vias 520 each pass through the first multilayer PCB 502. In some embodiments, a second set of vias 522 each pass through the second multi-layer PCB 504.

[00136] In some embodiments, a first feed 524 passes at least partially through second multi-layer PCB 504, dielectric slab 506, and first multi-layer PCB 502. In some

embodiments, a second feed 526 passes at least partially through second multi-layer PCB 504, dielectric slab 506, and first multi-layer PCB 502. For example, a microstrip antenna 500 that is a dual-polarized antenna includes two feeds (e.g., first feed 524 to transmit and/or receive horizontally polarized waves and second feed 526 to transmit and/or receive vertically polarized waves). In some embodiments, a microstrip antenna 500 that is a single- polarized antenna includes only a single feed (e.g., first feed 524). First feed 524 and second feed 526 are, for example, metallic pins.

[00137] In some embodiments, a first signal (e.g., a first RF power wave) is provided to first feed 524 via a first cable 528. In some embodiments, first feed 524 excites the microstrip antenna 500 using the first signal for transmission of RF power waves by the microstrip antenna 500. In some embodiments, a second signal (e.g., a second RF power wave) is provided to second feed 526 via a second cable 530. In some embodiments, second feed 526 excites the microstrip antenna 500 using the second signal for transmission of RF power waves by the microstrip antenna 500. In some embodiments, first cable 528 and/or second cable 530 are coupled to an output of processor(s) 104 of transmitter 102a

(processor(s) 102 and transmitter 102a are discussed in detail above in reference to Figure 1).

[00138] Having a single microstrip antenna with two multi-layer PCBs at opposite ends of a dielectric slab helps to improve manufacturability of antennas. For example, in some embodiments, electrically conductive material is printed on PCBs 508 and 514 using established PCB printing techniques. In some embodiments, any desired slab of material is usable as a substrate (e.g., dielectric substrate 506) to which multi-layer PCBs are attached.

[00139] Figure 6 illustrates a top view of a first multi-layer PCB 502, in accordance with some embodiments. An electrically conductive material (e.g., layer 510) is shown at the top of first PCB 508. Figure 6 illustrates an embodiment in which first feed 524 and second feed 526 partially puncture first PCB 508, causing distortion of the top surface of first PCB 508. Distortion regions 602 and 604 show locations of first feed 524 and second feed 526, respectively, within the first multi-layer PCB 502.

[00140] A first set of vias 520 pass through the first multi-layer PCB 502. In some embodiments, a y-axis distance 606 between vias of the plurality of vias 520 and/or an x-axis distance 608 between vias of the plurality of vias 520 is much smaller than a wavelength λ that corresponds to a target frequency (e.g., 900 MHz) for transmission and/or reception by microstrip antenna 500. Additionally, the microstrip antenna 500 (of which PCB 502 is a component) also has a maximum cross-sectional dimension which is much smaller than this wavelength (as discussed below in reference to Figure 7). For example, in some

embodiments, y-axis distance 606 and/or x-axis distance 608 (or the maximum cross- sectional dimension of the microstrip antenna 500) is equal to or less than λ/10 (e.g., λ/20). In some embodiments, y-axis distance 606 and/or x-axis distance 608 is 2.0 mm. In some embodiments, a diameter of a respective via of the plurality of vias 520 is less than or equal to 2.0 mm (e.g., 1.0 mm).

[00141] Figure 7 illustrates an x-axis dimension 702 and a y-axis dimension 704 of microstrip antenna 500, in accordance with some embodiments. In some embodiments, one or more dimensions of microstrip antenna 500 are determined based on a target bandwidth. For example, in some embodiments, x-axis dimension 702 and/or y-axis dimension 704 is/are much smaller than a wavelength λ that corresponds to a target frequency (e.g., 900 MHz) of power waves transmitted by the microstrip antenna 500. In some embodiments, the microstrip antenna 500 has an x-axis dimension 702 of less than or equal to 50.8 mm (e.g., 40 mm). In some embodiments, the microstrip antenna 500 has a y-axis dimension 704 of less than or equal to 50.8 mm (e.g., 30 mm). For example, in some embodiments, the microstrip antenna 500 has an x-axis dimension 702 of 25.4 mm and a y-axis dimension 704 of 25.4 mm.

[00142] Figure 8 is an expanded cross-sectional view of first multi-layer PCB 502 that illustrates a material formed on an interior surface of at least a subset of vias of the plurality of vias 520, in accordance with some embodiments. In some embodiments, a via-coating material (e.g., via-coating material 802 and 804) is formed on an interior surface of one or more vias (e.g., an interior surface of each via) of the plurality of vias 520. For example, the interior surface of one or more vias is plated with the via-coating material. In some embodiments, the via-coating material is a heat-conducting material and/or an electrically- conductive material. In some embodiments, the via-coating material is conductively coupled to a first electrically conductive material (e.g., electrically conductive material 510 as shown at the top of first PCB 508 and/or electrically conductive material 512 as shown at the bottom of first PCB 508). For example, the via-coating material is conductively coupled to a first electrically conductive material such that heat and/or electrons are conducted between electrically conductive layer 510, the via-coating material, and electrically conductive layer 512. In some embodiments, via-coating material is conductively coupled to a second electrically conductive material (e.g., electrically conductive material 516 as shown at the top of second PCB 514 and/or electrically conductive material 518 as shown at the bottom of second PCB 514). In some embodiments, the via-coating material and the electrically conductive material (e.g., first electrically conductive material and/or second electrically conductive material) are the same material.

[00143] Figure 9 illustrates an array 900 of microstrip antennas, in accordance with some embodiments. In some embodiments, array 900 is used as an antenna array 110 of a transmitter 102 within a wireless power transmission environment 100 as illustrated in Figure 1 and described above. Array 900 includes a plurality of component antennas, such as multiple microstrip antennas 500 (e.g., first microstrip antenna 500a, second microstrip antenna 500b, and third microstrip antenna 500c). Although three microstrip antennas are shown in Figure 9, it will be recognized that other numbers of antennas may be included in array 900, e.g., 2-10 antennas.

[00144] In some embodiments, formation of array 900 includes arranging the respective multi-layer PCBs of microstrip antennas 500a, 500b, and 500c, and forming a single dielectric slab 506 relative to the respective multi-layer PCBs. For example, the respective multi-layer PCBs are exposed to a liquid state of the dielectric material and a dielectric slab is formed when the dielectric material transitions from a liquid state to a solid state. In other words, the dielectric slab 506 is formed around the respective multi-layer PCBs.

[00145] In some embodiments, formation of array 900 includes attaching respective multi-layer PCBs of microstrip antennas 500a, 500b, and 500c to a dielectric slab 506 using an adhesive or other mechanical restraint.

[00146] In some embodiments, transmission of RF waves by array 900 is controlled by a plurality of control elements (not shown). In some embodiments, a respective control element of the plurality of control elements includes one or more feeds. For example, a first control element controls first feed 524 and/or second feed 526. In some embodiments, a first control element causes microstrip antenna 500a to transmit a first RF signal, a second control element causes microstrip antenna 500b to transmit a second RF signal, and a third control element causes microstrip antenna 500c to transmit a third RF signal. In some embodiments, the first RF signal is transmitted with at least one characteristic that is distinct from a corresponding characteristic associated with the second RF signal and/or the third RF signal. In some embodiments, the control elements receive signals from processor(s) 104 of transmitter 102. For example, a control element includes an output terminal of processor(s) 104 and/or a communication channel from processor(s) 104 to a microstrip antenna 500.

[00147] Although a horizontal arrangement of microstrip antennas 500a, 500b, and

500c is shown in Figure 9, it will be recognized that alternative arrangements may be used, such as a vertical arrangement of microstrip antennas 500 and/or a grid arrangement of microstrip antennas 500.

[00148] In some embodiments, multiple antenna arrays 900 may be included in a respective transmitter 102 and each of the multiple antenna arrays may be configured to transmit power waves at different frequencies (e.g., a first antenna array maybe configured to transmit at 900 MHz and a second antenna array may be configured to transmit at 2.4 GHz). To allow for transmission at the different frequencies, each of the multiple antenna arrays may have antennas that are of different dimensions or shapes (e.g., the first antenna array may include larger antennas than the second antenna array).

REPRESENTATIVE PROCESSES (II)

[00149] Figures 1 OA- IOC are a flowchart representation of a method 1000 for forming an antenna, in accordance with some embodiments.

[00150] In some embodiments, forming an antenna optionally includes forming (1002- a) a first multi-layer PCB 502 and forming (1002-b) a second multi-layer PCB 504. In some embodiments, forming the first multi-layer PCB 502 includes printing a first electrically conductive layer on the top and bottom surfaces of the first multi-layer PCB (e.g., printing the electrically conductive layer as shown at top surface 510 and bottom surface 512 of first PCB 508, Figure 5). In some embodiments, forming the second multi-layer PCB 504 includes printing the second electrically conductive layer on the top and bottom surfaces of the second multi-layer PCB (e.g., printing the electrically conductive layer as shown at top surface 516 and bottom surface 518 of second PCB 514, Figure 5). [00151] In some embodiments, forming a multi-layer PCB includes coupling an electrically conductive material (e.g., copper tape or other conductive material) to a substrate (e.g., PCB) by lamination (e.g., using an adhesive such as glue). In some embodiments, a multi-layer PCB is formed using a holding structure such as one or more notches and/or tabs such that an electrically conductive material is physically held in place relative to a substrate by the holding structure.

[00152] In some embodiments, forming the first multi-layer PCB 502 optionally includes depositing (1004-a) a first heat-conductive material on an interior surface of at least a subset of the first plurality of vias 520. In some embodiments, forming the second multilayer PCB 504 optionally includes depositing (1004-b) a second heat-conductive material on an interior surface of at least a subset of the second plurality of vias 522. For example, a first heat-conductive material is deposited on an interior surface of one or more vias as shown at 802 and 804 of Figure 8.

[00153] In some embodiments, depositing a first heat-conductive material on an interior surface of at least a subset of the first plurality of vias 520 includes depositing (1006- a) the first heat-conductive material such that the first heat-conductive material (e.g., as shown at 802 and 804 of Figure 8) is thermally coupled to the first electrically conductive material (e.g., as shown at 510 and 512 of Figure 5) of the first multi-layer PCB 502. In some embodiments, depositing a second heat-conductive material on an interior surface of at least a subset of the second plurality of vias includes depositing (1006-b) the second heat- conductive material such that the second heat-conductive material is thermally coupled to the second electrically conductive material (e.g., as shown at 516 and 518 of Figure 5) of the second multi-layer PCB 504. In some embodiments, the heat-conducting material is a metal such as copper, aluminum, brass, steel, and/or bronze.

[00154] Turning now to Figure 10B, in some embodiments, forming an antenna includes forming (1008) a dielectric assembly by coupling a dielectric slab 506 to a first multi-layer PCB 502 and a second multi-layer PCB 504. The first multi-layer PCB 502 includes (1008-a) a top surface and a bottom surface that is opposite the top surface. The top and bottom surfaces of the first multi-layer PCB 502 include a first electrically conductive material (e.g., as shown at 510 and 512 of Figure 5). A first plurality of vias 520 each substantially pass through the top and bottom surfaces of the first multi-layer PCB 502. The second multi-layer PCB 504 includes (1008-b) a top surface and a bottom surface that is opposite the top surface. The top and bottom surfaces of the second multi-layer PCB 504 include a second electrically conductive material (e.g., as shown at 516 and 518 of Figure 5). A second plurality of vias 522 each substantially pass through the top and bottom surfaces of the second multi-layer PCB 504.

[00155] In some embodiments, dielectric slab 506 includes a dielectric material fabricated from an exotic and/or synthetic material, such as a material that has a high dielectric constant (e.g., a moldable ceramic). For example, in some embodiments, dielectric slab 506 has a dielectric constant between 1.0 and 40 (e.g., a dielectric constant of 30). In some embodiments, the dielectric slab 506 is formed from stone, ceramic, plastic, and/or glass, or gas (e.g., in a container). In some embodiments, dielectric slab 506 is fabricated from a material that is capable of insulating, reflecting, and/or absorbing electric current. In some embodiments, dielectric slab 506 is fabricated from one or more materials that are engineered to yield predetermined magnetic permeability and/or electrical permittivity values. In some embodiments, at least one of a magnetic permeability value or an electrical permittivity value of dielectric slab 506 is based upon at least one predetermined power- transfer requirement and/or compliance constraint (e.g., in compliance with one or more government regulations).

[00156] In some embodiments, coupling the dielectric slab 506 to the first multi-layer

PCB 502 and the second multi-layer PCB 504 optionally includes (1010) coupling the first multi-layer PCB 502 to the dielectric slab 506 using an adhesive (e.g., glue, epoxy, potting compound, or other suitable adhesive) and coupling the second multi-layer PCB 504 to the dielectric slab 506 using the adhesive.

[00157] In some embodiments, coupling the dielectric slab 506 to the first multi-layer

PCB 502 and the second multi-layer PCB 504 optionally includes (1012) arranging the first multi-layer PCB 502 and the second multi-layer PCB 504 relative to dielectric material while it is in a liquid state, wherein the first multi-layer PCB 502 and the second multi-layer PCB 504 have fixed positions within the dielectric slab 506 after the dielectric material of the dielectric slab 506 transitions from the liquid state to a solid state. For example, the dielectric material of dielectric slab 506 is a ceramic, plastic, or other state-changing material that is capable of transitioning from a liquid state to a set solid state. In some embodiments, the first multi-layer PCB 502 and the second multi-layer PCB 504 are coupled to the dielectric slab 506 by molding the dielectric material around the first multi-layer PCB 502 and the second multi-layer PCB 504. For example, the dielectric slab 506 is shaped to include two reservoirs that are configured to receive the first and second multi-layer PCBs and the dielectric slab 506 is then baked so that the first and second multi-layer PCBs are then securely attached within the respective reservoirs of the dielectric slab 506.

[00158] In some embodiments, forming an antenna includes coupling (1014) at least one feed (e.g., first feed 524 and/or second feed 526) to the dielectric assembly (e.g., dielectric slab 506, first multi-layer PCB 502, and second multi-layer PCB 504). For example, the at least one feed is coupled to the dielectric assembly by inserting the at least one feed into the dielectric assembly (e.g., by drilling one or more holes at least partially through the dielectric slab 506, first multi-layer PCB 502, and second multi-layer PCB 504 and inserting the at least one feed into the one or more holes). In some embodiments, the at least one feed is coupled to the dielectric assembly by attaching the at least one feed to a surface of dielectric slab 506, first multi-layer PCB 502, and/or second multi-layer PCB 504 with adhesive or other coupling means.

[00159] In some embodiments, coupling the at least one feed to the dielectric assembly optionally includes inserting (1016) the at least one feed into the dielectric assembly such that the at least one feed (e.g., first feed 524 and/or second feed 526) at least partially passes through at least one of: the first multi-layer PCB 502, the dielectric slab 506, or the second multi-layer PCB 504. For example, in Figure 5, first feed 524 and second feed 526 are shown passing fully through second multi-layer PCB 504, passing fully through the dielectric slab 506, and passing partially through first multi-layer PCB 502.

[00160] In some embodiments, the at least one feed substantially (e.g., at least halfway) passes through (1018) the first multi-layer PCB 502, the second multi-layer PCB 504, and the dielectric slab 506. For example, a feed substantially passes through a multilayer PCB when the feed passes at least halfway from the bottom of the multi-layer PCB to the top of the multi-layer PCB.

[00161] In some embodiments, the first and second feeds are coupled to a power source and/or waveform generator (e.g., the power source and waveform generator described above in reference to Figure 1) that provides a signal for transmission by an assembled antenna (e.g., microstrip antenna 500, Figure 5).

REPRESENTATIVE SURFACE MOUNT DIELECTRIC ANTENNAS

[00162] Figure 11 is a block diagram of a surface mount dielectric antenna 1150, in accordance with some embodiments. In various embodiments, a surface mount dielectric antenna includes components as described with regard to surface mount dielectric antenna 1200 with a solid dielectric resonator 1202 (Figures 12A-12B), surface mount dielectric antenna 1300 with a hollow dielectric resonator 1302 (Figure 13), a surface mount dielectric antenna with a patch array feed ("patch array feed dielectric antenna") 1400 (Figure 14), and/or a surface mount dielectric antenna with a split ring feed ("split ring feed dielectric antenna") 1600 (Figure 16). Surface mounting a dielectric resonator to a PCB improves device miniaturization, production speed, and lowers production costs by enabling mass assembly in less time (e.g., by soldering a dielectric resonator directly to a PCB).

[00163] In some embodiments, a surface mount dielectric antenna 1150 includes a resonator 1152. For example, resonator 1152 is a solid dielectric resonator, such as solid dielectric resonator 1202 described with regard to Figure 12, or a resonator with a resonator cavity 1153, such as hollow dielectric resonator 1302, 1402, or 1602 described with regard to Figures 13, 14, and 16, respectively.

[00164] A resonator 1152 as described herein is fabricated, in accordance with some embodiments, from a material that is configured to resonate for transmission and/or absorption of electromagnetic radiation. For example, resonator 1152 is fabricated from silicon and/or silicon dioxide. In some embodiments, resonator 1152 is fabricated from a dielectric material that has a dielectric constant between 1 and 40. In some embodiments, resonator 1152 is fabricated from material capable of insulating, reflecting, and/or absorbing electrical current, or otherwise housing one or more electrical channels. In some

embodiments, at least one of the magnetic permeability and electrical permittivity properties is selected based upon a predetermined power-transfer requirement and/or compliance constraint (e.g., to satisfy one or more government regulations, such as exposure limits established by FCC regulations).

[00165] In some embodiments, resonator 1152 is coupled to a base 1158, such as a printed circuit board (PCB) (e.g., PCB 1204, PCB 1310, PCB 1408, and/or PCB 1614) or a portion thereof. In some embodiments, a coupling between a surface mount dielectric antenna and a PCB includes a mounting element 1168 (e.g., mounting platform 1206 and/or one or more legs 1308). In some embodiments, resonator 1152 is mounted directly to base 1158 (e.g., via solder, glue, or other surface mounting materials). In some embodiments, additional components such as one or more electronic components (e.g., capacitors, inductors, and/or integrated circuits) are mounted (e.g., surface mounted) to base 1158.

[00166] In some embodiments, base 1158 includes a feed 1160. Feed 1160 is, e.g., a dipole element 1162 (e.g., one or more dipole elements 1208, 1306), patch array feed 1164 (e.g., a plurality of patches 1406), and/or a split ring feed 1166 (e.g., split ring feed 1606). It will be recognized that alternative feeds (e.g., any radiating element that excites a field in a resonator 1152) may be used.

[00167] In some embodiments, feed 1160 is electronically coupled to resonator 1152. In some embodiments, feed 1160 transmits signals (e.g., signals generated by a processor 104 using a waveform generator or other signal source) to resonator 1152, thereby causing the dielectric resonator to resonate. For example, a surface mount dielectric antenna 1150 that is a component of antenna array 110 of a transmitter 102 transmits electromagnetic waves (e.g., power waves 116) by causing resonation of resonator 1152. In some embodiments, surface mount dielectric antenna 1150 receives electromagnetic waves and feed 1160 receives signals from resonator 1152 (e.g., when surface mount dielectric antenna 1150 is included as an antenna 1124 of receiver 1120). In some embodiments, surface mount dielectric antenna 1150 transmits and receives electromagnetic waves. In some embodiments, multiple resonators 1152 are mounted to a single base 1158. In some embodiments, a feed 1160 is electronically coupled to one or more signal sources, such as one or more outputs of processor 104, a tuner or a coupler. In some embodiments, one or more elements of feed 1160 (e.g., one or more dipole elements 1162, one or more patches 1406 of patch array 1164, and/or one or more excitation slots 1608 of split ring feed 1166) are electronically coupled to an integrated circuit that manages the transmission/reception of electromagnetic waves by surface mount dielectric antenna 1150. In some embodiments, one or more elements of feed 1160 are coupled to one or more transmission lines (e.g., a copper trace) of base 1158.

[00168] In some embodiments, feed 1160 is fabricated from a metal (e.g., copper). In some embodiments, feed 1160 is fabricated from a synthetic material engineered for magnetic permeability and/or electrical permittivity properties (e.g., negative permittivity and/or negative permeability), such as a metamaterial.

[00169] In some embodiments, the configuration (e.g., dimensions, material, layout, shape and/or effective length) of the one or more dipole elements 1162 is selected to produce desired impedance matching characteristics (e.g., for impedance matching with feed 1160 and/or the resonator 1152) and/or bandwidth characteristics. In some embodiments, one or more dipole elements 1162 are fabricated from plastic, ceramic, metal (e.g., steel, copper, copper alloy, and/or other metal), and/or a composite material. For example, one or more dipole elements 1162 are fabricated from stamped metal. In some embodiments, a mounting element 1160 and one or more dipole elements 1162 are fabricated (e.g., molded) as a single element. In some embodiments, a mounting element 1160 isolates at least a portion of the one or more dipole elements 1162 from a base 1158 by providing space between at least a portion of the one or more dipole elements 1208 and the PCB 1204.

[00170] Various design aspects of surface mount dielectric antenna 1150, such as the dimensions of the resonator 1152 (e.g., cross-sectional area and height of the resonator 1152), hollow or solid resonator design, size and shape of dipoles 1162, one or more dimensions of base 1158 (e.g., the cross-sectional area height of the base 1158), size and arrangement of patches on base 1158, and/or size and arrangement of split-ring contacts on base 1158 are selected (e.g., optimized using a cost function) for obtaining desired antenna characteristics. Antenna characteristics that vary based on the above design aspects include, e.g., size, weight, cost, fabrication efficiency, radiation efficiency, isolation between adjacent surface mount dielectric antennas 1150 in an antenna array, impedance matching (e.g., between resonator 1152 and feed 1160), and/or frequency range (for transmission and/or reception of electromagnetic waves by the antenna).

[00171] In some embodiments, an array of surface mount dielectric resonator antennas

(e.g., antennas 1200, 1300, 1400, and/or 1600) are mounted onto a single base 1158. For example, an array of 16 (e.g., 4 x 4), 64 (e.g., 8 x 8) or 100 (e.g., 10 x 10) antennas are mounted to a base 1158. In some embodiments, an array of surface mount dielectric antennas 1150 includes multiple types of antennas (e.g., patch array feed dielectric antenna 1400 and a split ring feed dielectric antenna 1600 are mounted on the same base 1158). In some embodiments, resonators 1152 and feeds 1160 are mounted in various patterns among capacitors, resistors, inductors, and/or integrated circuits on a base 1158. In some

embodiments, a surface mount dielectric resonator antenna 1150 is connected to one or more other antennas by way of a transmission line (e.g., transmission line 1210, 1312).

[00172] In some embodiments, a frequency at which surface mount dielectric antenna

1150 transmits and/or receives electromagnetic waves varies based on a length (x-axis dimension), width (y-axis dimension) and/or height (z-axis dimension) of resonator 1152.

[00173] In some embodiments, a surface mount dielectric antenna 1150 that has a resonator 1152 with a height (a distance between upper edge 1313 and lower edge 1316, as shown in Figure 13) of approximately 25.4 mm transmits and/or receives electromagnetic waves within a frequency range that includes 5.8 GHz. In some embodiments, a surface mount dielectric antenna 1150 that has a resonator 1152 with a height of approximately 50.8 mm transmits and/or receives electromagnetic waves within a frequency range that includes 900 MHz.

[00174] In some embodiments, a surface mount dielectric antenna 1150 as described herein has dimensions of λ/8 or smaller, where λ is a wavelength that corresponds to a frequency of electromagnetic waves transmitted by the antenna 1150. For example, a surface mount dielectric antenna 1150 with x-axis and y-axis dimensions of 40 mm x 40 mm transmits and/or receives electromagnetic waves within a frequency range that includes 900 MHz.

[00175] Turning now to Figures 12A-17, various embodiments and features of the antenna 150 are illustrated therein and described below. The antennas 1200, 1300, 1400, and 1600 are non-limiting example embodiments of the antenna 1150. As will be apparent to one of skill in the art, the various features and configurations of each of the antennas 1200, 1300, 1400, and 1600 may be combined or substituted in various ways to produce a variety of additional embodiments of the antenna 1150 (e.g., various configurations of the antenna 1150 may include solid or at least partially hollow dielectric resonators, and may also include different types of feed elements, including a dipole element, patch array feed element, and/or split ring feed element). In some embodiments, an array of antennas 1150 may include different types/ configurations of individual antennas 1150. For example, an array of antennas 1150 includes individual antennas 1150 arranged in a linear configuration, a planar configuration, or a non-planar (e.g., cylindrical array) configuration.

[00176] Figures 12A-12B illustrate a surface mount dielectric antenna 1200 with a solid dielectric resonator 1202, in accordance with some embodiments. Figure 12A illustrates a top view of surface mount dielectric antenna 1200 with a solid dielectric resonator 1202 and Figure 12B illustrates a perspective view of surface mount dielectric antenna 1200 with a solid dielectric resonator 1202.

[00177] In some embodiments, solid dielectric resonator 1202 is coupled to a mounting platform 1206 that is mounted on a PCB 1204. In some embodiments, mounting platform 1206 includes one or more legs 1207 that separate mounting platform 1206 from PCB 1204. In some embodiments, mounting platform 1206 is omitted and solid dielectric resonator 1202 is mounted directly to PCB 1204. Mounting platform 1206 may be fabricated from, e.g., plastic, ceramic, a composite material, and/or metal. In some embodiments, mounting platform 1206 is fabricated (e.g., molded) as a single element. [00178] In some embodiments, mounting platform 1206 is a ground for surface mount dielectric resonator antennas 1200. In some embodiments, one or more characteristics of mounting platform 1206 (e.g., a shape and/or one or more dimensions of mounting platform 1206) are selected to produce desired impedance matching characteristics and/or bandwidth characteristics. In some embodiments, mounting platform 1206 isolates the one or more dipole elements 1208 from PCB 1204.

[00179] In some embodiments, PCB 1204 includes one or more transmission lines

1210 (e.g., a copper trace). In some embodiments, a transmission line 1210 transmits signals (e.g., signals received from a processor 104) to solid dielectric resonator 1202, thereby causing solid dielectric resonator 1202 to resonate. In some embodiments, a transmission line 1210 conducts signals from solid dielectric resonator 1202 (e.g., when a surface mount dielectric antenna 1200 with a solid dielectric resonator 1202 is included in an antenna 124 of receiver 120). In some embodiments, the transmission line 1210 forms a meandered line pattern on a surface of the PCB (as shown in Figures 12A-12B).

[00180] Surface mount dielectric antenna 1200 includes one or more dipole elements 1208. For example, the one or more dipole elements 1208 couple transmission line 1210 to solid dielectric resonator 1202. In some embodiments, the one or more dipole elements 1208 are radiating feeding dipoles. In some embodiments, one or more dipoles 1208 have a "meandering line" feature (e.g., the S-shape and reverse-S-shape visible in Figure 12B for dipole elements 1208a, 1208b) that increases the effective length of the dipole element. In some embodiments, one or more characteristics of a dipole element 1208 (e.g., dipole element 1208a, 1208b), such as the effective length of the dipole elements 1208, is selected to produce desired impedance matching characteristics (e.g., for impedance matching with transmission line 1210 and/or solid dielectric resonator 1202). In some embodiments, characteristics (such as a shape and/or one or more dimensions) of the one or more dipole elements 1208, mounting platform 1206, and/or solid dielectric resonator 1202 are selected based on a targeted power transfer requirement (e.g., to ensure that 80% or more of transmitted energy is received by the one or more electronic devices 122).

[00181] In some embodiments, surface mount dielectric antenna 1200 includes a plurality of vias 1212 located at or near the edge of PCB 1204. In some embodiments, the plurality of vias 1212 partial or fully surround solid dielectric resonator 1202. In some embodiments, the plurality of vias 1212 provides grounding and isolates the surface mount dielectric antenna 1200 from any adjacent antennas. The number and/or density of vias 1212 may vary from the illustrative example of Figures 12A-12B. In some embodiments, multiple solid dielectric resonators 1202 (or other dielectric resonators, such as hollow dielectric resonators 1302) are mounted on a single PCB 1204, and vias 1212 are configured to surround each solid dielectric resonator 1202 on the PCB 1204.

[00182] Figure 13 illustrates a surface mount dielectric antenna 1300 with a hollow dielectric resonator 1302, in accordance with some embodiments.

[00183] Hollow dielectric resonator 1302 includes a cavity 1304. In comparison with a solid dielectric resonator 1202, a hollow dielectric resonator 1302 of the same dimensions has a lower weight (e.g., while providing an acceptable receiving and/or transmitting frequency range). The reduced weight of surface mount dielectric antenna 1300 due to the lower weight of hollow dielectric resonator 1302 reduces the weight of a transmitter 102 and/or receiver 120 that includes one or more hollow dielectric resonator antennas 1300. The reduced weight advantageously allows for increased portability of a device that includes the hollow dielectric resonator antennas 1300 in lieu of larger and/or heavier antennas. In some embodiments, in comparison with a solid dielectric resonator 1202, a hollow dielectric resonator 1302 of the same dimensions has a weight that is reduced by at least 30%.

[00184] In some embodiments, cavity 1304 is formed in hollow dielectric resonator

1302 at the time at which hollow dielectric resonator 1302 is fabricated (e.g., hollow dielectric resonator 1302 is molded such that cavity 1304 is present in hollow dielectric resonator 1302). In some embodiments, cavity 1304 is formed in hollow dielectric resonator 1302 by mechanically removing a portion of material from a solid dielectric element. In some embodiments, cavity 1304 extends from an upper edge 1313 of hollow dielectric resonator 1302 to a lower edge 1316 of hollow dielectric resonator 1302. In some embodiments, cavity 1304 extends from an upper edge 1313 of hollow dielectric resonator 1302 to a location that is partway between lower edge 1316 of hollow dielectric resonator 1302 and upper edge 1313 of hollow dielectric resonator 1302 (see, e.g., hollow dielectric resonator 1402, Figure 14 and hollow dielectric resonator 1602, Figure 16). In some embodiments, the volume of cavity 1304 relative to the volume of hollow dielectric resonator 1302 increases as the required gain of surface mount dielectric antenna 1300 increases. In some embodiments, a cross-sectional profile of cavity 1304 is, e.g., square, circular, and/or polygonal. In some embodiments, cavity 1304 has a hexahedronal or cylindrical shape.

[00185] In some embodiments, hollow dielectric resonator 1302 is coupled to one or more legs 1308 that are coupled to (e.g., soldered to) a PCB 1310. In some embodiments, the one or more legs 1308 are omitted and hollow dielectric resonator 1302 is mounted directly to PCB 1310. The one or more legs 1308 are fabricated from, e.g., plastic, ceramic, a composite material, and/or metal. In some embodiments, legs 1308 isolate the one or more dipole elements 1306 from PCB 1310 by providing space between the one or more dipole elements 1306 and the PCB 1310.

[00186] In some embodiments, PCB 1310 includes one or more transmission lines

1312 (e.g., a copper trace). In some embodiments, a transmission line 1312 conducts/ transmits signals (e.g., signals received from a processor 104) to hollow dielectric resonator 1302, thereby causing hollow dielectric resonator 1302 to resonate. In some embodiments, a transmission line 1312 receives signals from hollow dielectric resonator 1302 (e.g., when a surface mount dielectric antenna 1300 with a hollow dielectric resonator 1302 is included in an antenna 124 of receiver 120). As shown in Figure 13, in some embodiments of the antenna 1300, the one or more transmission lines 1312 form a meandered line pattern on a surface of the PCB.

[00187] In some embodiments, surface mount dielectric antenna 1300 includes one or more dipole elements 1306. For example, the one or more dipole elements 1306

electronically couple transmission line 1312 to hollow dielectric resonator 1302. In some embodiments, dipole elements 1306 include properties as described with regard to dipole elements 1208 (e.g., the dipole elements 1306 have a meandering line feature, which is discussed in more detail above in reference to Figure 12B).

[00188] In some embodiments, surface mount dielectric antenna 1300 includes a plurality of vias 1314 located at or near the edge of PCB 1310. In some embodiments, the plurality of vias 1314 partial or fully surround hollow dielectric resonator 1302. The plurality of vias 1314 provides grounding and isolates the surface mount dielectric antenna 1300 from any adjacent antennas.

[00189] Figure 14 illustrates a patch array feed dielectric antenna 1400, in accordance with some embodiments. In some embodiments, patch array feed dielectric antenna 1400 includes a hollow dielectric resonator 1402 coupled to a PCB 1408. A plurality of patches 1406 are coupled to upper surface 1414 of PCB 1408.

[00190] Each patch 1406 is electronically coupled to a via 1405 that passes through PCB 1408. The combination of a patch 1406 and via 1405 is referred to as a "mushroom antenna element." Lower surface 1412 of PCB 1408 includes a ground plane 1412. In some embodiments, each patch 1406 receives a signal carried by via 1405. [00191] In some embodiments, each patch of the plurality of patches 1406 are fabricated from a metal (e.g., copper). In some embodiments, each patch of the plurality of patches 1406 is fabricated from a metamaterial.

[00192] In some embodiments, the array of patches 1406 is a uniformly spaced array of patches 1406 (e.g., the size of each patch 1406 is the same and/or the spacing between adjacent patches 1406 in the plurality of patches 1406 is the same). In some embodiments, at least one patch 1406 has a rectangular (e.g., square) shape. In some embodiments, the patches 1406 of the array of patches 1406 are arranged in a non-uniform or random pattern. Figures 15A-15B show alternative configurations of patches 1406 on PCB 1408. In some embodiments, patch array feed dielectric antenna 1400 includes a slot antenna (e.g., on ground plane 1412).

[00193] In some embodiments, the plurality of patches 1406 control a field and/or aperture of electromagnetic transmissions by patch array feed dielectric antenna 1400, e.g., to meet power transmission requirements. In some embodiments, adjustments to the size and/or spacing of patches 1406 on PCB 1408 cause adjustments to filter, radiation efficiency, and/or isolation characteristics of patch array feed dielectric antenna 1400. For example, a range of frequencies at which patch array feed dielectric antenna 1400 is able to transmit and/or receive electromagnetic waves is related to characteristics of the patch array such as the size of the surface area of one or more of the patches 1406.

[00194] In some embodiments, hollow dielectric substrate 1402 is mounted on (e.g., soldered to) a PCB 1408 (e.g., such that hollow dielectric substrate 1402 is in contact with at least a subset of the plurality of patches 1406. In some embodiments, hollow dielectric substrate 1402 has any of the properties described above with regard to hollow dielectric resonator 1302 as described with regard to Figure 13. In some embodiments, cavity 1404 has any of the properties of cavity 1304 as described with regard to Figure 14. Although the example in Figure 14 shows patch array feed dielectric antenna 1400 including a hollow dielectric resonator 1402, in some embodiments, patch array feed dielectric antenna 1400 includes a solid dielectric resonator (such as that described above in reference to Figures 12A-12B).

[00195] Figures 15A-15B show illustrative configurations of the plurality of patches

1406 of patch array feed dielectric antenna 1400, in accordance with some embodiments.

[00196] In some embodiments, a first patch 1406 on PCB 1408 (e.g., patch 1406a) has a first size (e.g., cross-sectional area) that is different from a second size of a second patch 1406 (e.g., patch 1406b) on PCB 1408. For example, in Figure 15A first patch 1406a that is at or near the center of PCB 1408 (and/or at or near the center of hollow dielectric resonator 1402) has a larger cross-sectional area than a second patch 1406b that is adjacent to edge of PCB 1408 (and/or at or near the edge of hollow dielectric resonator 1402). This

configuration of respective patches of a smaller size surrounding a patch of a larger size helps to "trap" electromagnetic radiation by preventing that radiation from expanding beyond the area of the plurality of patches 1406.

[00197] In Figure 15B, a set of patches (e.g., including patch 1406c that is near an edge of PCB 1408 (and/or near the edge of hollow dielectric resonator 1402) has a smaller area than a set of patches (e.g., including patch 1406d) that is at and/or near the center of PCB 1408 (and/or at or near the center of hollow dielectric resonator 1402). Increasing the distance between the patches near that edge of PCB 1408, such as patch 1406c, and patches that are near the edge of PCB 1408, such as patch 1406d, provides increased isolation when signals are transmitted by adjacent antennas in an antenna array (e.g., when patch array feed dielectric antenna 1400 that includes patches configured as shown in Figure 15B transmits a signal that signal radiates outward without as much leaking to an adjacent antenna in an array of which the antenna 1400 is a component).

[00198] In some embodiments, gaps between adjacent patches 1406 on a PCB 1408 are uniformly sized. In some embodiments, gaps between adjacent patches 1406 on a PCB 1408 are non-uniformly sized. For example, in some embodiments, a first gap size (e.g., the first gap size is illustrated as gap size 1500 in Figure 15B) between a first set of adjacent patches 1406c on PCB 1408 is different from a second gap size (e.g., the second gap size is illustrated as at gap size 1502 in Figure 15B) between a second set of adjacent patches 1406d on PCB 1408.

[00199] Figure 16 illustrates a split ring feed dielectric antenna 1600, in accordance with some embodiments. In some embodiments, a split ring feed dielectric antenna 1600 includes a hollow dielectric resonator 1602 (e.g., with a cavity 1604), split ring feed 1606, one or more excitation slots 1608 (e.g., 1608a and 1608b) and/or one or more contacts 1610 (e.g., 1610a and 1610b). In some embodiments, split ring feed dielectric antenna 1600 is mounted on (e.g., soldered to) a PCB 1614.

[00200] In some embodiments, split ring feed dielectric antenna 1600 includes two contacts 1610a and 1610b, separated by dielectric substrate 1616. In some embodiments, the dielectric substrate 1616 is the surface of PCB 1614. In some embodiments, contact 1610a and/or contact 1610b is fabricated from a metal, such as copper. In some embodiments, contact 1610a and/or contact 1610b is fabricated from a metamaterial. In some

embodiments, the two excitation slots 1608a and 1608b include vias that connect the bottom of PCB 1614 to the hollow dielectric resonator 1602 for excitation of contacts 1610a and 1610b. In some embodiments, a via of first excitation slot 1608a excites a first contact 1610a using a first signal and a via of second excitation slot 1608b excites a second contact 1610b using a second signal that is distinct from the first signal (e.g., the amplitude and/or phase of the first signal differs from the amplitude and/or phase of the second signal). In some embodiments, a via of first excitation slot 1608a excites a first contact 1610a in a first magnetic polarity and a via of second excitation slot 1608b excites a second contact 1610b in a second magnetic polarity that is opposite to the first magnetic polarity.

[00201] In some embodiments, hollow dielectric substrate 1602 has any of the properties described above with regard to hollow dielectric resonator 1302 as described with regard to Figure 13. In some embodiments, cavity 1604 has any of the properties of cavity 1304 as described with regard to Figure 13. Although in Figure 16, split ring feed dielectric antenna 1600 is shown including a hollow dielectric resonator 1602, in some embodiments, split ring feed dielectric antenna 1600 may include a solid dielectric resonator (such as that described above in reference to Figures 12A-12B).

[00202] Figure 17 illustrates a y-axis dimension 1702 (width) and an x-axis dimension

1704 (length) of base 1158 of a surface mount dielectric antenna 1150, in accordance with some embodiments. In some embodiments, one or more dimensions of surface mount dielectric antenna 1150 are determined based on a target bandwidth of a signal transmitted by the antenna 1150. For example, in some embodiments, y-axis dimension 1702 and/or x-axis dimension 1704 is/are much smaller than a wavelength λ that corresponds to a target frequency (e.g., 900 MHz) of power waves transmitted by the surface mount dielectric antenna 1150. In some embodiments, the surface mount dielectric antenna 1150 has a y-axis dimension 1702 of less than or equal to 50.8 mm (e.g., 40 mm). In some embodiments, the surface mount dielectric antenna 1150 has an x-axis dimension 1704 of less than or equal to 50.8 mm (e.g., 40 mm). In some embodiments, multiple surface mount dielectric antennas 1150 are mounted on a single PCB (e.g., PCB 1204, PCB 1310, PCB 1408, and/or PCB 1614). In some embodiments, the base 1158 is a portion of the single PCB that corresponds to a single antenna element (e.g., a portion delineated by vias 1212 or 1314, a portion that corresponds to a cross-sectional area of dielectric resonator 1202 or 1302, a portion that corresponds to the set of patches 1406 coupled to a single dielectric resonator 1402, and/or a portion that corresponds to a cross-sectional area of dielectric resonator 1602).

[00203] Although some of various drawings illustrate a number of logical stages in a particular order, stages that are not order dependent may be reordered and other stages may be combined or broken out. While some reordering or other groupings are specifically mentioned, others will be obvious to those of ordinary skill in the art, so the ordering and groupings presented herein are not an exhaustive list of alternatives. Moreover, it should be recognized that the stages could be implemented in hardware, firmware, software or any combination thereof.

[00204] Features of the present disclosure can be implemented in, using, or with the assistance of a computer program product, such as a storage medium (media) or computer- readable storage medium (media) having instructions stored thereon/in which can be used to program a processing system to perform any of the features presented herein. The storage medium (e.g., memory 106) can include, but is not limited to, high-speed random access memory, such as DRAM, SRAM, DDR RAM or other random access solid state memory devices, and may include non-volatile memory, such as one or more magnetic disk storage devices, optical disk storage devices, flash memory devices, or other non-volatile solid state storage devices. Memory 106 optionally includes one or more storage devices remotely located from the CPU(s) 104. Memory 106, or alternatively the non-volatile memory device(s) within memory 106, comprises a non-transitory computer readable storage medium.

[00205] Stored on any one of the machine readable medium (media), features of the present invention can be incorporated in software and/or firmware for controlling the hardware of a processing system, and for enabling a processing system to interact with other mechanism utilizing the results of the present invention. Such software or firmware may include, but is not limited to, application code, device drivers, operating systems, and execution environments/containers.

[00206] Communication systems as referred to herein (e.g., communications component 112, transmitter 102; communication component 136, electronic device 122, communication component 144, receiver 120) optionally communicates via wired and/or wireless communication connections. Communication systems optionally communicate with networks, such as the Internet, also referred to as the World Wide Web (WWW), an intranet and/or a wireless network, such as a cellular telephone network, a wireless local area network (LAN) and/or a metropolitan area network (MAN), and other devices by wireless communication. Wireless communication connections optionally use any of a plurality of communications standards, protocols and technologies, including but not limited to radio- frequency (RF), radio-frequency identification (RFID), infrared, radar, sound, Global System for Mobile Communications (GSM), Enhanced Data GSM Environment (EDGE), high-speed downlink packet access (HSDPA), high-speed uplink packet access (HSUPA), Evolution, Data-Only (EV-DO), HSPA, HSPA+, Dual-Cell HSPA (DC-HSPDA), long term evolution (LTE), near field communication (NFC), ZigBee, wideband code division multiple access (W-CDMA), code division multiple access (CDMA), time division multiple access (TDMA), Bluetooth, Wireless Fidelity (Wi-Fi) (e.g., IEEE 102.11a, IEEE 102.1 lac, IEEE 102.1 lax, IEEE 102.1 lb, IEEE 102.1 lg and/or IEEE 102.1 In), voice over Internet Protocol (VoIP), Wi-MAX, a protocol for e-mail (e.g., Internet message access protocol (IMAP) and/or post office protocol (POP)), instant messaging (e.g., extensible messaging and presence protocol (XMPP), Session Initiation Protocol for Instant Messaging and Presence Leveraging

Extensions (SIMPLE), Instant Messaging and Presence Service (IMPS)), and/or Short Message Service (SMS), or any other suitable communication protocol, including

communication protocols not yet developed as of the filing date of this document.

[00207] It will also be understood that, although the terms first, second, etc. are, in some instances, used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first antenna could be termed a second antenna, and, similarly, a second antenna could be termed a first antenna, without departing from the scope of the various described embodiments.

[00208] The terminology used in the description of the various described embodiments herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used in the description of the various described embodiments and the appended claims, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will also be understood that the term "and/or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items. It will be further understood that the terms "includes," "including," "comprises," and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. [00209] As used herein, the term "if is, optionally, construed to mean "when" or

"upon" or "in response to determining" or "in response to detecting" or "in accordance with a determination that," depending on the context. Similarly, the phrase "if it is determined" or "if [a stated condition or event] is detected" is, optionally, construed to mean "upon determining" or "in response to determining" or "upon detecting [the stated condition or event]" or "in response to detecting [the stated condition or event]" or "in accordance with a determination that [a stated condition or event] is detected," depending on the context.

[00210] The foregoing description, for purpose of explanation, has been described with reference to specific embodiments. However, the illustrative discussions above are not intended to be exhaustive or to limit the scope of the claims to the precise forms disclosed. Many modifications and variations are possible in view of the above teachings. The embodiments were chosen in order to best explain the principles underlying the claims and their practical applications, to thereby enable others skilled in the art to best use the embodiments with various modifications as are suited to the particular uses contemplated.