Title:
DIAGNOSTING RELIABILITY OF VIAS BY E-BEAM PROBING
Document Type and Number:
WIPO Patent Application WO2001098788
Kind Code:
A3
Abstract:
Electronic devices, such as IC devices, are tested by determining a failure net within the electronic device that is causing a device failure. After identifying the failure net, the failure net is locally stressed. The stress is applied so that only the net being tested is subjected to the stress, and the remaining nets and components of the device are not stressed. A change in a signal produced by the failure net is observed while the failure bet is being subjected to the stress. The testing in this manner assists in identifying the failure net as a failure source of the device.
Inventors:
XIA WILLIAM
VILLAFANA MARTIN
TAPPAN JONATHAN
WATSON TIM
CAMPBELL MICHAEL
VILLAFANA MARTIN
TAPPAN JONATHAN
WATSON TIM
CAMPBELL MICHAEL
Application Number:
PCT/US2001/019943
Publication Date:
August 29, 2002
Filing Date:
June 21, 2001
Export Citation:
Assignee:
QUALCOMM INC (US)
International Classes:
G01R31/30; G01N23/225; G01R31/307; G01R31/317; G01R31/319; H01J37/28; H01L21/66; (IPC1-7): G01R31/307
Foreign References:
| US5231350A | 1993-07-27 | |||
| US5192913A | 1993-03-09 | |||
| US5122753A | 1992-06-16 | |||
| US5943346A | 1999-08-24 |
Other References:
See also references of EP 1292838A2
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