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Patent Searching and Data


Title:
DIAMINE COMPOUND, PREPARATION METHOD THEREFOR, THERMOSETTING RESIN COMPOSITION, AND APPLICATION
Document Type and Number:
WIPO Patent Application WO/2020/232597
Kind Code:
A1
Abstract:
The present invention provides a diamine compound, a preparation method therefor, and a thermosetting resin composition. The diamine compound has a structure as represented by structural formula (I). The structure of the diamine compound has both an aromatic amine group and an aryl ester-based functional group. As a curing agent for epoxy resin, the thermosetting resin composition of the diamine compound is low in dielectric constant and dielectric loss factor, has good thermal resistance and toughness, and has excellent bond strength to metals.

Inventors:
LIN WEI (CN)
XI LONG (CN)
HUANG TIANHUI (CN)
YOU JIANG (CN)
Application Number:
PCT/CN2019/087608
Publication Date:
November 26, 2020
Filing Date:
May 20, 2019
Export Citation:
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Assignee:
SHENGYI TECHNOLOGY CO LTD (CN)
International Classes:
C07C229/52; C07C227/04; C07C229/54; C08G59/50
Foreign References:
EP0462060A21991-12-18
CN104114532A2014-10-22
JPH05194339A1993-08-03
JPH05194340A1993-08-03
CN107857880A2018-03-30
CN101857609A2010-10-13
Other References:
DER-JANG LIAW ET AL.: "Photolysis of bisphenol-based polyurethanes in solution", JOURNAL OF POLYMER SCIENCE: PART A: POLYMER CHEMISTRY, vol. 37, no. 9, 21 January 2000 (2000-01-21), pages 1331 - 1339, XP000803982, ISSN: 2642-4169
Attorney, Agent or Firm:
CHINA SCIENCE PATENT & TRADEMARK AGENT LTD. (CN)
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