Title:
DIAMOND-BASED COMPOSITE MATERIAL, METHOD FOR MANUFACTURING SAME, HEAT DISSIPATION MEMBER, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/085134
Kind Code:
A1
Abstract:
A diamond-based composite material including 40-70 vol% of diamond particles, the remainder comprising Ag and unavoidable impurities, and the content of Cr relative to the content of Ag being 0.5-5 vol%, and a method for manufacturing said diamond-based composite material, said method including: a step for firing, at a temperature ranging from the temperature at which a liquid phase of Ag appears to no higher than 1100°C, a molded body obtained by molding a mixture of diamond powder, Ag powder, and Cr powder; and a step for performing hot isostatic pressing of the resultant temporarily sintered compact at a pressure of 0.2-100 MPa and a temperature ranging from the temperature at which a liquid phase of Ag appears to no higher than 1100°C.
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Inventors:
KONO SAKI (JP)
WATANABE YUKI (JP)
WADA KOUHEI (JP)
WATANABE YUKI (JP)
WADA KOUHEI (JP)
Application Number:
PCT/JP2020/039622
Publication Date:
April 28, 2022
Filing Date:
October 21, 2020
Export Citation:
Assignee:
FUJI DIE CO (JP)
International Classes:
B22F3/10; B22F3/15; B22F3/16; C22C1/05; C22C26/00; C22C32/00; H01L23/373; H05K7/20
Domestic Patent References:
| WO2020084903A1 | 2020-04-30 |
Foreign References:
| JP2016136549A | 2016-07-28 | |||
| JP5350553B1 | 2013-11-27 |
Attorney, Agent or Firm:
TAKAISHI Kitsuma (JP)
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