Title:
DIAMOND BLADE AND METHOD OF PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2000/030810
Kind Code:
A1
Abstract:
A diamond blade having a cutting section consisting of diamond abrasive grains and attached to the outer peripheral edge of a substrate in order to decrease the wear of the under-head region of a cutting diamond blade, characterized in that at least either the front or the back of the substrate is provided with an island-shaped cutting section separated from the first-mentioned cutting section, an extended cutting section extending toward the center of the substrate or an approximately U-shaped profiled cutting section. Also a method of producing diamond blades, characterized by simultaneously performing the sintering of the cutting section and the binding of it with the substrate.
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Inventors:
SUZUKI KOICHI (JP)
Application Number:
PCT/JP1999/005229
Publication Date:
June 02, 2000
Filing Date:
September 24, 1999
Export Citation:
Assignee:
SANKYO DIAMOND IND CO LTD (JP)
SUZUKI KOICHI (JP)
SUZUKI KOICHI (JP)
International Classes:
B23D61/02; B24D5/12; B24D18/00; B28D1/12; (IPC1-7): B24D5/12; B24D5/06; B24D5/00; B24D3/00; B24D3/06
Foreign References:
| JPH0760650A | 1995-03-07 | |||
| JPH04101781A | 1992-04-03 | |||
| JPS5867653U | 1983-05-09 | |||
| JPH10180639A | 1998-07-07 | |||
| JPH0890425A | 1996-04-09 |
Other References:
See also references of EP 1050375A4
Attorney, Agent or Firm:
Akiyama, Atsushi (Toranomon 3-chome Minato-ku, Tokyo, JP)
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