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Patent Searching and Data


Title:
DIAMOND SAW BLADE
Document Type and Number:
WIPO Patent Application WO/2000/051789
Kind Code:
A1
Abstract:
A diamond saw blade (D) comprising diamond grindstones (2) attached to the outer peripheral edge of a disc-shaped substrate (1), wherein a ratio of a second value (total areas of end faces (e) of the diamond grindstones (2)) to a first value (calculated by multiplying a periphery length of a circle having a diameter which is a maximum outside diameter of the diamond saw blade (D) by a maximum thickness (t) of the disc-shaped substrate (1)) is at least 0.3 and up to 1.0.

Inventors:
YOSHIDA TAKUMA (JP)
MASHIKO KAZUHIRO (JP)
KOBAYASHI SHIGEYOSHI (JP)
Application Number:
PCT/JP2000/001061
Publication Date:
September 08, 2000
Filing Date:
February 24, 2000
Export Citation:
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Assignee:
SANKYO DIAMOND IND CO LTD (JP)
TOHO TITANIUM CO LTD (JP)
YOSHIDA TAKUMA (JP)
MASHIKO KAZUHIRO (JP)
KOBAYASHI SHIGEYOSHI (JP)
International Classes:
B23D61/02; B24D5/06; B24D5/12; B28D1/12; B28D1/24; (IPC1-7): B24D5/12; B24D3/00
Foreign References:
GB2281075A1995-02-22
JPH0731266U1995-06-13
JPH09272857A1997-10-21
JPH08309664A1996-11-26
JPH03113757U1991-11-21
Other References:
See also references of EP 1114696A4
Attorney, Agent or Firm:
Akiyama, Atsushi (Toranomon 3-chome Minato-ku, Tokyo, JP)
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