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Patent Searching and Data


Title:
DIAMOND WHEEL AND SCRIBING DEVICE
Document Type and Number:
WIPO Patent Application WO/2004/110712
Kind Code:
A1
Abstract:
A diamond wheel (8) allowed to roll on the surface of a brittle material without slipping and less producing horizontal cracks in the brittle material. The diamond wheel (8) rolls on the surface of the brittle material to form a scribing line thereon. In the diamond wheel, diamond particles (15)...of 1000 to 8000 meshes are held thereto with a bonding agent. Since the diamond particles projected from the binding agent (16) are easily bitten in the brittle material, even if a load more than necessary is not given to the diamond wheel, the diamond wheel can roll on the brittle material without slipping.

Inventors:
Ishikawa, Hirokazu c/o Daito Seiki Co. Ltd. (13-2, Nishi-gotanda 3-chom, Shinagawa-ku Tokyo 31, 14100, JP)
Application Number:
PCT/JP2004/007684
Publication Date:
December 23, 2004
Filing Date:
June 03, 2004
Export Citation:
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Assignee:
THK CO., LTD. (11-6, Nishi-gotanda 3-chome Shinagawa-ku, Tokyo 31, 14100, JP)
BELDEX CORPORATION (11-10, Toyotamakita 4-chome Nerima-ku, Tokyo 12, 17600, JP)
Ishikawa, Hirokazu c/o Daito Seiki Co. Ltd. (13-2, Nishi-gotanda 3-chom, Shinagawa-ku Tokyo 31, 14100, JP)
International Classes:
B28D1/22; C03B33/027; C03B33/10; B28D1/22; C03B33/00; (IPC1-7): B28D5/00; C03B33/10
Attorney, Agent or Firm:
Ishikawa, Yasuo (Park Shiba Building 4F, 17-11 Shiba 2-chom, Minato-ku Tokyo 14, 10500, JP)
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