Title:
DIAMOND WIRE SAW
Document Type and Number:
WIPO Patent Application WO/2011/046301
Kind Code:
A3
Abstract:
The present invention relates to a diamond wire saw which cuts a silicon ingot for solar light, and more particularly to a diamond wire saw which has an optimized volume ratio of a chip pocket, prevents diamond particles from falling and smoothly discharges chips generated in a cutting process.
Inventors:
LEE HYOUNGYOON (KR)
JEONG YONGWHA (KR)
RYOO MINHO (KR)
JEONG YONGWHA (KR)
RYOO MINHO (KR)
Application Number:
PCT/KR2010/006209
Publication Date:
July 14, 2011
Filing Date:
September 13, 2010
Export Citation:
Assignee:
ILJIN DIAMOND CO LTD (KR)
LEE HYOUNGYOON (KR)
JEONG YONGWHA (KR)
RYOO MINHO (KR)
LEE HYOUNGYOON (KR)
JEONG YONGWHA (KR)
RYOO MINHO (KR)
International Classes:
B23D61/18; B23Q11/00; B28D1/08
Foreign References:
| JP2006231479A | 2006-09-07 | |||
| JPH09150314A | 1997-06-10 | |||
| JP4175728B2 | 2008-11-05 |
Attorney, Agent or Firm:
DARAE IP FIRM (647-9 Yeoksam-dong, Gangnam-gu, Seoul 135-080, KR)
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