Title:
DIAPHRAGM STRUCTURE OF SOUNDING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2016/061713
Kind Code:
A1
Abstract:
A diaphragm structure of a sounding apparatus. The diaphragm structure comprises: a thin-film layer (11); a first circuit thin-film layer (21), fixed on a first side (111) of the thin-film layer (11) by means of a first electrolytic bonding layer (41); a second circuit thin-film layer (22), fixed on a second side (112) of the thin-film layer (11) by means of a second electrolytic bonding layer (42); multiple holes (5), passing through the first circuit thin-film layer (21), the thin-film layer (11) and the second circuit thin-film layer (22); and multiple conductive layers (51), disposed on inner circumferential walls of the holes (5) and in contact with the first circuit thin-film layer (21) and the second circuit thin-film layer (22). According to the diaphragm structure, an electrolytic bonding mode is used to replace traditional back adhesive to fix circuit thin-film layers on two sides of a thin-film layer, and accordingly, the thickness of the diaphragm structure is greatly reduced.
Inventors:
TENG KO-CHUNG (CN)
Application Number:
PCT/CN2014/000945
Publication Date:
April 28, 2016
Filing Date:
October 24, 2014
Export Citation:
Assignee:
TENG KO-CHUNG (CN)
International Classes:
H04R7/06
Foreign References:
CN204259145U | 2015-04-08 | |||
TWM448101U | 2013-03-01 | |||
CN1087770A | 1994-06-08 | |||
CN1666569A | 2005-09-07 | |||
JP2000345369A | 2000-12-12 | |||
TW201119417A | 2011-06-01 | |||
TW201129124A | 2011-08-16 | |||
US20090027833A1 | 2009-01-29 |
Attorney, Agent or Firm:
CHINA LONGRIVER PATENT & TRADEMARK OFFICE (GENERAL PARTNERSHIP) (CN)
北京华夏博通专利事务所(普通合伙) (CN)
北京华夏博通专利事务所(普通合伙) (CN)
Download PDF: