DICING BLADE - TOKYO SEIMITSU CO LTD

Title:

DICING BLADE

Document Type and Number:

WIPO Patent Application WO/2013/161849

Kind Code:

A1

Abstract:

Provided is a dicing blade with which cutting work can be performed stably and precisely in a ductile mode on a workpiece formed of a brittle material, without generating cracks or breaking. This dicing blade (26), which performs cutting work on a workpiece, is formed integrally in the shape of a disk by means of a diamond sintered body (80) formed by sintering diamond abrasive grains (82). The content of the diamond abrasive gains (82) in the diamond sintered body (80) is at least 80% by volume. Preferably, recessed parts formed in the surface of the diamond sintered body (80) are provided continuously in the circumferential direction at the outer circumferential part of the dicing blade (26).

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Inventors:

WATANABE JUNJI (JP)
FUJITA TAKASHI (JP)
IZUMI YASUO (JP)

Application Number:

PCT/JP2013/061998

Publication Date:

October 31, 2013

Filing Date:

April 24, 2013

Export Citation:

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Assignee:

TOKYO SEIMITSU CO LTD (JP)
SHIN NIHON TECH INC (JP)
WATANABE JUNJI (JP)

International Classes:

H01L21/301; B24D3/00; B24D5/00; B24D5/12

Domestic Patent References:

WO2009148073A1

2009-12-10

Foreign References:

JPH05144937A	1993-06-11
JP2005129741A	2005-05-19
JP2002331464A	2002-11-19
JP2005129741A	2005-05-19
JP2010234597A	2010-10-21
JP2010005778A	2010-01-14
JP3308246B2	2002-07-29
JP4714453B2	2011-06-29
JP3892204B2	2007-03-14
JP2003326466A	2003-11-18
JP2012030992A	2012-02-16
JPH07276137A	1995-10-24
JPS61104045A	1986-05-22

Other References: