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Title:
DICING BLADE
Document Type and Number:
WIPO Patent Application WO/2015/029987
Kind Code:
A1
Abstract:
Provided is a dicing blade capable of cutting even a workpiece composed of a brittle material stably and accurately in a ductile mode without causing cracks and breakage. This dicing blade (26) is attached to a rotatable spindle, and while rotating about the rotation axis of the rotatable spindle, cuts or grooves a flat plate-shaped workpiece to a constant depth of cut while the workpiece is relatively slid. This dicing blade (26) is integrally formed into a disc shape or a ring shape from a diamond sintered compact formed by sintering diamond abrasive grains, and is provided with, at the outer periphery of the dicing blade (26), a cutting edge part (40) in which minute cutting edges formed on the surface of the diamond sintered compact are provided continuously along a circumferential direction.

Inventors:
WATANABE, Junji (3-5-7-502 Kitanagao-cho, Kita-kuSakai-sh, Osaka 43, 〒5918043, JP)
FUJITA, Takashi (2968-2, Ishikawa-machi, Hachioji-sh, Tokyo 15, 〒1928515, JP)
IZUMI, Yasuo (2-2-81 Hama Tsurumi-ku, Osaka-sh, Osaka 35, 〒5380035, JP)
Application Number:
JP2014/072266
Publication Date:
March 05, 2015
Filing Date:
August 26, 2014
Export Citation:
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Assignee:
TOKYO SEIMITSU CO., LTD. (2968-2, Ishikawa-machi Hachioji-sh, Tokyo 15, 〒1928515, JP)
SHIN-NIHON TECH INC. (2-2-81 Hama, Tsurumi-ku Osaka-sh, Osaka 35, 〒5380035, JP)
WATANABE, Junji (3-5-7-502 Kitanagao-cho, Kita-kuSakai-sh, Osaka 43, 〒5918043, JP)
International Classes:
H01L21/301; B24B27/06; B24D3/00; B24D3/06; B24D5/00; B24D5/12; B28D5/02
Foreign References:
JP2002192469A2002-07-10
JP2010010514A2010-01-14
JPH02241106A1990-09-25
JP2012086291A2012-05-10
JP2001334471A2001-12-04
JP2009045723A2009-03-05
Attorney, Agent or Firm:
MATSUURA, Kenzo (Matsuura & Associates, P.O. Box 176 Shinjuku Sumitomo Bldg. 23F, 6-1, Nishi-shinjuku 2-chome, Shinjuku-k, Tokyo 23, 〒1630223, JP)
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