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Patent Searching and Data


Title:
DICING BLADE
Document Type and Number:
WIPO Patent Application WO/2015/029987
Kind Code:
A1
Abstract:
Provided is a dicing blade capable of cutting even a workpiece composed of a brittle material stably and accurately in a ductile mode without causing cracks and breakage. This dicing blade (26) is attached to a rotatable spindle, and while rotating about the rotation axis of the rotatable spindle, cuts or grooves a flat plate-shaped workpiece to a constant depth of cut while the workpiece is relatively slid. This dicing blade (26) is integrally formed into a disc shape or a ring shape from a diamond sintered compact formed by sintering diamond abrasive grains, and is provided with, at the outer periphery of the dicing blade (26), a cutting edge part (40) in which minute cutting edges formed on the surface of the diamond sintered compact are provided continuously along a circumferential direction.

Inventors:
WATANABE JUNJI (JP)
FUJITA TAKASHI (JP)
IZUMI YASUO (JP)
Application Number:
PCT/JP2014/072266
Publication Date:
March 05, 2015
Filing Date:
August 26, 2014
Export Citation:
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Assignee:
TOKYO SEIMITSU CO LTD (JP)
SHIN NIHON TECH INC (JP)
WATANABE JUNJI (JP)
International Classes:
H01L21/301; B24B27/06; B24D3/00; B24D3/06; B24D5/00; B24D5/12; B28D5/02
Foreign References:
JP2002192469A2002-07-10
JP2010010514A2010-01-14
JPH02241106A1990-09-25
JP2012086291A2012-05-10
JP2001334471A2001-12-04
JP2009045723A2009-03-05
Attorney, Agent or Firm:
MATSUURA, Kenzo (JP)
Kenzo Matsuura (JP)
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