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Patent Searching and Data


Title:
DICING DEVICE, DICING METHOD, AND DICING TAPE
Document Type and Number:
WIPO Patent Application WO/2019/155707
Kind Code:
A1
Abstract:
A dicing device 10 in which a work table 12 and a blade 18 that is made to rotate by a spindle 20 are moved relative to each other and dicing is performed in a state in which a workpiece W is held on the work table 12 with a dicing tape T interposed therebetween, wherein the dicing device 10 comprises: a cutting mark detection unit 52 that detects cutting mark information formed on a surface region of the dicing tape T to which a workpiece W is not affixed; and a control unit 56 that, on the basis of the cutting mark information detected by the cutting mark detection unit 52, controls the height of the blade 18 so that the depth to which the dicing tape T is cut is uniform.

Inventors:
FUKE, Tomoki (2968-2, Ishikawa-machi, Hachioji-sh, Tokyo 15, 〒1928515, JP)
SHIMIZU, Tasuku (2968-2, Ishikawa-machi, Hachioji-sh, Tokyo 15, 〒1928515, JP)
NISHIYAMA, Masaki (2968-2, Ishikawa-machi, Hachioji-sh, Tokyo 15, 〒1928515, JP)
Application Number:
JP2018/041727
Publication Date:
August 15, 2019
Filing Date:
November 09, 2018
Export Citation:
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Assignee:
TOKYO SEIMITSU CO., LTD. (2968-2, Ishikawa-machi Hachioji-sh, Tokyo 15, 〒1928515, JP)
International Classes:
H01L21/301; B24B27/06; B24B49/12
Attorney, Agent or Firm:
MATSUURA, Kenzo (Matsuura & Associates, P.O. Box 176 Shinjuku Sumitomo Bldg. 23F, 6-1, Nishi-shinjuku 2-chome, Shinjuku-k, Tokyo 23, 〒1630223, JP)
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