Title:
DICING DIE ATTACH FILM, METHOD FOR PRODUCING SAME, SEMICONDUCTOR PACKAGE, AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2022/201687
Kind Code:
A1
Abstract:
A dicing die attach film which has a dicing film and a die attach film layered on this dicing film, wherein the die attach film contains an organic solvent which has a boiling point no less than 100°C and less than 150°C and a vapor pressure of 50 mmHg or less, and the content of the organic solvent in the die attach film satisfies formula (a). (a) When 1.0g of the die attach film is immersed in 10.0mL of acetone for 24 hours at 4°C, the extracted organic solvent concentration in said acetone is 800μg or less.
Inventors:
MORITA MINORU (JP)
OTANI YOTA (JP)
MARUYAMA HIROMITSU (JP)
OTANI YOTA (JP)
MARUYAMA HIROMITSU (JP)
Application Number:
PCT/JP2021/047140
Publication Date:
September 29, 2022
Filing Date:
December 20, 2021
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
C09J11/04; C09J7/30; C09J11/06; C09J11/08; C09J163/00; H01L21/301; H01L21/52
Domestic Patent References:
| WO2017158994A1 | 2017-09-21 | |||
| WO2021033368A1 | 2021-02-25 |
Foreign References:
| JP2010062553A | 2010-03-18 | |||
| US20090162650A1 | 2009-06-25 | |||
| JP2008103700A | 2008-05-01 |
Attorney, Agent or Firm:
IIDA & PARTNERS et al. (JP)
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