Title:
DICING SHEET, METHOD FOR MANUFACTURING DICING SHEET, AND METHOD FOR MANUFACTURING MOLDED CHIP
Document Type and Number:
WIPO Patent Application WO/2016/017265
Kind Code:
A1
Abstract:
The invention is a dicing sheet provided with a substrate and a pressure-sensitive adhesive layer layered onto one surface of the substrate. The pressure-sensitive adhesive layer is formed of a pressure-sensitive adhesive composition containing an acrylic polymer (A) having an energy ray-polymerizable group and a reactive functional group, and an isocyanate crosslinking agent (B) capable of a crosslinking reaction with the reactive functional group. The acrylic polymer (A) is obtained as a result of an acrylic polymer (A1) having a reactive functional group and an isocyanate compound (A2) having an energy ray-polymerizable group reacting in the presence of an organometallic catalyst (C) containing titanium and/or zirconium. In the acrylic polymer (A1), the mass ratio of a monomer (m1) imparting the structural unit that has the reactive functional group relative to all the monomers imparting the acrylic polymer (A1) is 5 to 30 mass%. In the reaction for forming the acrylic polymer (A), the amount of compound (A2) that is used is 0.4 to 0.8 equivalent amounts to the monomer (m1). The amount of energy of the surface of the pressure-sensitive adhesive layer on the dicing sheet is 0.4 to 0.8 mJ/5 mmφ.
Inventors:
NISHIDA TAKUO (JP)
Application Number:
PCT/JP2015/065855
Publication Date:
February 04, 2016
Filing Date:
June 02, 2015
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
H01L21/301; C09J7/20; C09J133/00; C09J175/04
Domestic Patent References:
| WO2013042698A1 | 2013-03-28 | |||
| WO2014020962A1 | 2014-02-06 |
Foreign References:
| JP2012180494A | 2012-09-20 |
Attorney, Agent or Firm:
HAYAKAWA, Yuzi et al. (JP)
Yuji Hayakawa (JP)
Yuji Hayakawa (JP)
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