Title:
DICING SHEET, METHOD FOR PRODUCING DICING SHEET, AND METHOD FOR PRODUCING MOLDED CHIP
Document Type and Number:
WIPO Patent Application WO/2016/151912
Kind Code:
A1
Abstract:
This dicing sheet is provided with a substrate and an adhesive layer that is layered on at least one surface of the substrate. The adhesive layer is formed from an adhesive composition that contains: an acrylic polymer (A) having an energy ray-polymerizable group and a reactive functional group; and an isocyanate crosslinking agent (B) capable of a crosslinking reaction with the reactive functional group. The storage elastic modulus of the adhesive layer at 23 °C is 50-80 kPa prior to irradiation with energy rays and 5.0 MPa or more after irradiation with energy rays. The thickness of the adhesive layer is less than 20 µm. The energy amount of the surface of the adhesive layer as measured using probe tack prior to irradiation with energy rays under a condition in which the peeling speed is changed by 1 mm/minute in accordance with the method described in JIS Z0237:1991 is 0.1-0.8 mJ/5 mmφ. This dicing sheet reduces the possibility of the occurrence of defects in any of a dicing step, an expansion step, and a pick-up step. The use of this dicing sheet makes it possible to produce a cost-effective molded chip of excellent quality.
Inventors:
NISHIDA TAKUO (JP)
SATO AKINORI (JP)
SATO AKINORI (JP)
Application Number:
PCT/JP2015/079514
Publication Date:
September 29, 2016
Filing Date:
October 20, 2015
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
H01L21/301; C09J4/00; C09J7/20; C09J133/00
Foreign References:
| JP2014022476A | 2014-02-03 | |||
| JP2002203822A | 2002-07-19 | |||
| JP2012180494A | 2012-09-20 |
Attorney, Agent or Firm:
HAYAKAWA, Yuzi et al. (JP)
Yuji Hayakawa (JP)
Yuji Hayakawa (JP)
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