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Patent Searching and Data


Title:
DICING SHEET AND METHOD FOR PRODUCING DICING SHEET
Document Type and Number:
WIPO Patent Application WO/2017/098736
Kind Code:
A1
Abstract:
A dicing sheet 1 which is provided with a base film 2 and an adhesive layer 3 that is laminated on one surface of the base film 2. The base film 2 is provided with at least a resin layer 21 that is positioned closest to the adhesive layer 3; the melting point of a resin which constitutes the resin layer 21 is from 60°C to 170°C (inclusive); and the difference between the melting point and the fluidization temperature of the resin is from 40°C to 190°C (inclusive). This dicing sheet 1 is able to be produced without requiring irradiation of radiation and is able to be suppressed in the formation of thread-like cut pieces, while exhibiting good expandability.

Inventors:
NITO YUKI (JP)
TAYA NAOKI (JP)
Application Number:
PCT/JP2016/053016
Publication Date:
June 15, 2017
Filing Date:
February 02, 2016
Export Citation:
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Assignee:
LINTEC CORP (JP)
International Classes:
C09J7/20; H01L21/301
Foreign References:
JP2013065682A2013-04-11
Attorney, Agent or Firm:
HAYAKAWA, Yuzi et al. (JP)
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