Title:
DICING SHEET WITH PROTECTIVE FILM FORMING LAYER AND CHIP FABRICATION METHOD
Document Type and Number:
WIPO Patent Application WO/2013/047674
Kind Code:
A1
Abstract:
[Problem] To provide a dicing sheet with a protective film forming layer that makes it possible to easily fabricate a semiconductor chip having a protective film with high film thickness uniformity and excellent printing accuracy, and that is expandable and uses a heat resistant substrate material. [Solution] A dicing sheet with a protective film forming layer according to the present invention has a substrate film, an adhesive layer, and a protective film forming layer, and at a minimum, the adhesive layer is formed in an area surrounding the protective film forming layer in a planar view, and the substrate film has the following characteristics (a)-(c): (a) the melting point either exceeds 130°C or the film has no melting point; (b) the thermal contraction rate under conditions of heating at 130°C for two hours is from -5 to +5%, and (c) the degree of elongation-to-break in the MD direction and the CD direction is at least 100%, and the stress at 25% is no more than 100 MPa.
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Inventors:
SHINODA TOMONORI (JP)
FURUDATE MASAAKI (JP)
TAKANO KEN (JP)
FURUDATE MASAAKI (JP)
TAKANO KEN (JP)
Application Number:
PCT/JP2012/074923
Publication Date:
April 04, 2013
Filing Date:
September 27, 2012
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
H01L21/301; C09J7/40; C09J201/00
Domestic Patent References:
| WO2010092804A1 | 2010-08-19 | |||
| WO2011132648A1 | 2011-10-27 |
Foreign References:
| JP2006140348A | 2006-06-01 | |||
| JP2008248129A | 2008-10-16 | |||
| JP2002280329A | 2002-09-27 | |||
| JP2003105278A | 2003-04-09 |
Attorney, Agent or Firm:
MAEDA, Hitoshi et al. (JP)
Hitoshi Maeda (JP)
Hitoshi Maeda (JP)
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Claims: