DICING SHEET

WIPO Patent Application WO/2013/175987

A1

A dicing sheet in which the possibility of the occurrence of defects can be reduced in all of a dicing step, an expanding step and a pick-up step. As such a dicing sheet, a dicing sheet (1) is provided, which comprises a base (2) and an adhesive agent layer (3) laminated on at least one surface of the base (2), wherein the adhesive agent layer is formed from an adhesive agent composition comprising an acrylic polymer (A) that is an acrylic polymer-based component, an energy-ray-polymerizable compound (B) and an adhesiveness-imparting resin (C), the adhesiveness-imparting resin (C) contains a polymerized rosin ester (C1) and also contains a disproportionated rosin ester (C2) and/or a petroleum-derived resin (C3), the content ratio of the polymerized rosin ester (C1) contained in the adhesive agent composition is 5 parts by mass relative to 100 parts by mass of the acrylic polymer (A), and the ratio of an adhesion force of the dicing sheet as measured after the irradiation with an energy ray to that as measured before the irradiation with the energy ray is 3 or more wherein each of the adhesion forces is measured by carrying out a 180˚ peeling test in accordance with JIS Z0237:2000 employing an exposed surface of the adhesive agent layer which is opposed to a side of the adhesive agent layer which faces the base as a surface to be measured and a resin-sealed surface of a semiconductor package as a surface which is to be adhered to the adhesive agent layer.

NISHIDA TAKUO (JP)
KANAI MICHIO (JP)

PCT/JP2013/063305

November 28, 2013

May 13, 2013

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LINTEC CORP (JP)

H01L21/301; C09J7/22; C09J7/38; C09J133/00; C09J157/02; C09J193/04; H01L21/56

JP2010083939A	2010-04-15
JP2009246216A	2009-10-22
JP2010258408A	2010-11-11

HAYAKAWA, Yuzi et al. (JP)
Yuji Hayakawa (JP)

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