Title:
DICING SYSTEM AND METHOD
Document Type and Number:
WIPO Patent Application WO/2010/056209
Kind Code:
A3
Abstract:
A singulation system for dicing IC units from a substrate comprising; a block (30) for receiving said substrate (31), said block movable from a substrate receiving station to a dicing station; a first dicing saw (10) for dicing the substrate when at the dicing station; a second dicing saw (15) for dicing the substrate when at the dicing station; wherein the first and second dicing saws are of different varieties so as to perform different dicing functions on said substrate.
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Inventors:
JUNG JONG JAE (SG)
BAEK SEUNG HO (SG)
LIM CHONG CHEN GARY (SG)
BAEK SEUNG HO (SG)
LIM CHONG CHEN GARY (SG)
Application Number:
PCT/SG2009/000426
Publication Date:
August 08, 2013
Filing Date:
November 16, 2009
Export Citation:
Assignee:
ROKKO SYSTEMS PTE LTD (SG)
JUNG JONG JAE (SG)
BAEK SEUNG HO (SG)
LIM CHONG CHEN GARY (SG)
JUNG JONG JAE (SG)
BAEK SEUNG HO (SG)
LIM CHONG CHEN GARY (SG)
International Classes:
B28D5/02; H01L21/304; H01L21/67
Foreign References:
| US6422227B1 | 2002-07-23 | |||
| US6250990B1 | 2001-06-26 | |||
| JP2008251597A | 2008-10-16 | |||
| JP2006286694A | 2006-10-19 |
Attorney, Agent or Firm:
ENGLISH, Matthew (Tanjong PagarP.O. Box 636, Singapore 6, SG)
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