Title:
DICING-TAPE-INTEGRATED ADHESIVE SHEET, SEMICONDUCTOR DEVICE, MULTILAYERED CIRCUIT BOARD AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2013/008757
Kind Code:
A1
Abstract:
The invention provides a dicing-tape-integrated adhesive sheet that has excellent handling properties, and can connect terminals of opposing members while simultaneously sealing gaps between members. This dicing-tape-integrated adhesive sheet has a laminated structure configured from: an adhesive film that electrically connects a first terminal of a support and a second terminal of an adherend using solder, and bonds the support and the adherend; and dicing tape. This dicing-tape-integrated adhesive sheet satisfies the relationship 1.2 × 103 ≤ (T × P)/η ≤ 1.5 × 109, wherein T [°C] is the application temperature when applying the adhesive film to the surface whereon the first terminal of the support is formed, P [MPa] is the pressure applied to the adhesive film, and η [Pa∙s] is the melt viscosity of the adhesive film at the aforementioned application temperature.
Inventors:
MAEJIMA KENZO (JP)
Application Number:
PCT/JP2012/067374
Publication Date:
January 17, 2013
Filing Date:
July 06, 2012
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
MAEJIMA KENZO (JP)
MAEJIMA KENZO (JP)
International Classes:
H01L21/301; C09J7/35; C09J11/06; C09J161/06; C09J163/00; C09J171/12; H01L21/60
Foreign References:
| JP2010118640A | 2010-05-27 | |||
| JP2009239138A | 2009-10-15 | |||
| JP2009212511A | 2009-09-17 |
Attorney, Agent or Firm:
TANAI Sumio et al. (JP)
Sumio Tanai (JP)
Sumio Tanai (JP)
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Claims: