Title:
DICING TAPE
Document Type and Number:
WIPO Patent Application WO/2016/111283
Kind Code:
A1
Abstract:
Provided is a dicing tape with which it is possible to minimize chip scattering and chipping during a dicing step, with which pickup can easily be performed, and with which adhesive residues are unlikely to remain even for small and thin electronic components. The present invention provides a dicing tape obtained by layering an adhesive layer comprising an adhesive composition on a substrate film, wherein the dicing tape is characterized in that: the adhesive composition contains 100 parts by mass of a (meth)acrylic acid ester copolymer, 5-250 parts by mass of a photopolymerizing compound, 0.1-20 mass parts of a curing agent, and 0.1-20 mass parts of a photopolymerizing initiator, the (meth)acrylic acid ester copolymer containing 35-85% by mass of a methyl (meth)acrylate unit, 10-60% by mass of a 2-ethylhexyl (meth)acrylate unit, 0.5-10% by mass of a monomer unit having a carboxyl group, and 0.05-5% by mass of a monomer unit having a hydroxyl group, the photopolymerizing compound being a urethane acrylate oligomer having a weight-average molecular weight of 4,000-8,000 and 10-15 unsaturated double-bond functional groups, and the thickness of the adhesive layer being 3-7 μm.
Inventors:
TSUKUI TOMOYA (JP)
Application Number:
PCT/JP2016/050102
Publication Date:
July 14, 2016
Filing Date:
January 05, 2016
Export Citation:
Assignee:
DENKA COMPANY LTD (JP)
International Classes:
H01L21/301; C09J4/02; C09J7/20; C09J11/06; C09J133/04; C09J175/14
Domestic Patent References:
| WO2010131616A1 | 2010-11-18 | |||
| WO2015141555A1 | 2015-09-24 | |||
| WO2016009879A1 | 2016-01-21 |
Foreign References:
| JP2012207163A | 2012-10-25 |
Attorney, Agent or Firm:
SK INTELLECTUAL PROPERTY LAW FIRM et al. (JP)
SK patent business corporation (JP)
SK patent business corporation (JP)
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