Title:
DIE ATTACH PASTE AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/034234
Kind Code:
A1
Abstract:
The die attach paste according to the present invention comprises: a (meth)acrylic copolymer (A) having a reactive group; a (meth)acrylic monomer (B); and a filler (C), the reactive group of the (meth)acrylic copolymer (A) being at least one group selected from an epoxy group, an amino group, a vinyl group, a carboxyl group, and a hydroxyl group, the weight average molecular weight of the (meth)acrylic copolymer (A) being 2000-14000, and the particle size D50 of the filler (C) upon 50% accumulation in a volume-basis particle size distribution being 0.3-4.0 μm.
More Like This:
| JPS5886732 | SEMICONDUCTOR ELEMENT |
Inventors:
KAWANA TAKASHI (JP)
SAITO KEIICHIRO (JP)
NISHI TAKAYUKI (JP)
SAITO KEIICHIRO (JP)
NISHI TAKAYUKI (JP)
Application Number:
PCT/JP2017/029106
Publication Date:
February 22, 2018
Filing Date:
August 10, 2017
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
H01L21/52; C08F2/44; C08G59/20; C09J4/06; C09J9/02; C09J11/04; C09J11/06; C09J11/08; C09J133/14; C09J167/00; C09J169/00
Domestic Patent References:
| WO2012133767A1 | 2012-10-04 | |||
| WO2012063747A1 | 2012-05-18 |
Foreign References:
| JP2014051590A | 2014-03-20 | |||
| JP2006339057A | 2006-12-14 | |||
| JP2012253088A | 2012-12-20 | |||
| JP2010031275A | 2010-02-12 | |||
| JP2009164500A | 2009-07-23 |
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
Download PDF: