Title:
DIE-ATTACH PASTE FOR SEMICONDUCTORS AND SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO2015122114
Kind Code:
A1
Abstract:
Provided are a die-attach paste for semiconductors and a semiconductor package, whereby a semiconductor package can be produced that maintains coating properties, is capable of suppressing bleeding after coating by B-staging, is capable of obtaining sufficient adhesiveness even without heating during die-bonding, and has high reliability. The die-attach paste for semiconductors includes: a (meth) acryloyl group-containing compound (1); a ring structure-containing compound (2) containing an oxirane ring structure or an oxetane ring structure; a maleic anhydride-modified polyolefin (3); and a photopolymerizable initiator (4). Furthermore, a highly reliable, highly integrated semiconductor package can be produced by coating this semiconductor die-attach paste on to a support member or a die, then B-staging by ultraviolet irradiation, then die-bonding.
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Inventors:
KOUKA HIROTO (JP)
OZAWA YUI (JP)
OZAWA YUI (JP)
Application Number:
PCT/JP2015/000117
Publication Date:
August 20, 2015
Filing Date:
January 13, 2015
Export Citation:
Assignee:
SHOWA DENKO KK (JP)
International Classes:
C08G59/42; H01L21/52
Foreign References:
| JP2010263041A | 2010-11-18 | |||
| JP2010223992A | 2010-10-07 | |||
| JP2012188463A | 2012-10-04 | |||
| JPH11228925A | 1999-08-24 | |||
| JP2006335861A | 2006-12-14 |
Attorney, Agent or Firm:
MORI, Tetsuya et al. (JP)
Woods Tetsuya (JP)
Woods Tetsuya (JP)
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